Epoxidized perfluoropolyethers: A route to hydrophobic, negative-tone photoresists

The synthesis, formulation, and wafer level processing conditions of a heavily fluorinated hydrophobic photoresist was demonstrated. The synthesis is based on terminal epoxy modification of commercially available perfluoropolyethers. Structural characterization shows that terminal epoxide can open d...

Full description

Saved in:
Bibliographic Details
Published in:Journal of applied polymer science 2012-06, Vol.124 (6), p.4636-4644
Main Authors: Chaffins, Sterling, Hinch, Garry, DeKam, Kevin, Waterhous, Vince, Smith, Jim, Overbay, Milo, Bilich, Dan, Hovermale, Chris, Jones, John
Format: Article
Language:English
Subjects:
Applied sciences
Crosslinking and degradation
Exact sciences and technology
fluoropolymer
Formulations
hydrophobic
lithography
Materials science
Photolithography
Photoresists
Physicochemistry of polymers
Polymers
Polymers and radiations
Resists
Solubility
Synthesis
Terminals
Wafers
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The synthesis, formulation, and wafer level processing conditions of a heavily fluorinated hydrophobic photoresist was demonstrated. The synthesis is based on terminal epoxy modification of commercially available perfluoropolyethers. Structural characterization shows that terminal epoxide can open during the synthetic process, but in a simple formulation has a negligible effect on photoresolution of the photoresist. Formulation into a traditional photoresist requires careful selection of appropriate cosolvents to ensure solubility of the hydrophobic epoxy and hydrophilic photoacid generator while attaining adequate coating quality. Formulation processing conditions are presented and the chemical resistance of the resist through aggressive processing steps is demonstrated. Wafer level patterning using traditional photolithographic tools illustrates the applicability of the formulation and process conditions for traditional resist or microfluidic applications. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011
ISSN:0021-8995
1097-4628
DOI:10.1002/app.35346