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New Cu3TeO6 Ceramics: Phase Formation and Dielectric Properties
Targeting low temperature cofired ceramics (LTCC) applications and base-metal electrode multilayer ceramic capacitors (BME-MLCCs), ceramics of a new composition, tricopper tellurate (Cu3TeO6), are reported here. The crystal structure of Cu3TeO6 was determined to be cubic, Ia3, with the unit cell par...
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Published in: | ACS applied materials & interfaces 2014-07, Vol.6 (14), p.11326-11332 |
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Main Authors: | , , , |
Format: | Article |
Language: | English |
Online Access: | Get full text |
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Summary: | Targeting low temperature cofired ceramics (LTCC) applications and base-metal electrode multilayer ceramic capacitors (BME-MLCCs), ceramics of a new composition, tricopper tellurate (Cu3TeO6), are reported here. The crystal structure of Cu3TeO6 was determined to be cubic, Ia3, with the unit cell parameter a = 9.538 Å. The sequence of phase formation is proposed with the oxidation of tetravalent tellurium (Te4+) into hexavalent tellurium (Te6+) as a key step for the formation of Cu3TeO6. Ceramics sintered at 865 °C with densities of 94% exhibit two dielectric anomalies in the temperature dependence of the dielectric response, around −150 °C and +50 °C, respectively, accompanied by obvious frequency dispersion of the relative permittivity (εr) and dielectric losses (tan δ), with an Arrhenius like behavior. A temperature stable dielectric region (near room temperature) formed between the two anomalies with εr ∼ 12 and tan δ ∼ 0.01, and a very low positive temperature coefficient of the relative permittivity (TCεr), 2.07 × 10–4 °C–1, was obtained in the same region. The low temperature dielectric anomaly is associated with the possible mixed Cu+/Cu2+ valence in Cu3TeO6 ceramics, while the high temperature anomaly is attributed to point defect ordering, including V O, CuCu2+ +′, which might be formed during sintering. Therefore, Cu3TeO6 ceramics are of interest in view of not only the possible applications in BME-MLCCs, LTCC, and related technologies, but also for their possible compatibility with low cost abundant Cu electrodes. |
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ISSN: | 1944-8244 1944-8252 |
DOI: | 10.1021/am501742z |