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Direct observation of the spin texture in SmB6 as evidence of the topological Kondo insulator
Topological Kondo insulators have been proposed as a new class of topological insulators in which non-trivial surface states reside in the bulk Kondo band gap at low temperature due to strong spin–orbit coupling. In contrast to other three-dimensional topological insulators, a topological Kondo insu...
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Published in: | Nature communications 2014-07, Vol.5 (1), p.4566-4566, Article 4566 |
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Main Authors: | , , , , , , , , , , , , , , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Topological Kondo insulators have been proposed as a new class of topological insulators in which non-trivial surface states reside in the bulk Kondo band gap at low temperature due to strong spin–orbit coupling. In contrast to other three-dimensional topological insulators, a topological Kondo insulator is truly bulk insulating. Furthermore, strong electron correlations are present in the system, which may interact with the novel topological phase. By applying spin- and angle-resolved photoemission spectroscopy, here we show that the surface states of SmB
6
are spin polarized. The spin is locked to the crystal momentum, fulfilling time reversal and crystal symmetries. Our results provide strong evidence that SmB
6
can host topological surface states in a bulk insulating gap stemming from the Kondo effect, which can serve as an ideal platform for investigating of the interplay between novel topological quantum states with emergent effects and competing orders induced by strongly correlated electrons.
The study and application of the conductive surface states of topological insulators are often restricted by the presence of bulk conduction states. Here, Xu
et al.
present evidence for such topological surface states with true bulk insulation in the strongly correlated Kondo insulator SmB
6
. |
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ISSN: | 2041-1723 2041-1723 |
DOI: | 10.1038/ncomms5566 |