Microstructural evolution and bonding mechanisms of the brazed Ti/ZrO sub(2) joint using an Ag sub(68.8)Cu sub(26.7)Ti sub(4.5) interlayer at 900 degree C

In this study, 3 mol% Y2O3-stabilized zirconia (3YZrO2) and commercially pure titanium (cp-Ti) joints were fabricated with an Ag68.8Cu26.7Ti4.5 interlayer (Ticusil) at 900 DGC for various brazing periods. After brazing at 900 DGC/0.1 h, Ti2Cu, TiCu, Ti3Cu4, and TiCu4 layers were present at the Ti/Ti...

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Bibliographic Details
Published in:Journal of materials research 2014-03, Vol.29 (5), p.684-694
Main Authors: Wei, Shen-Hung, Lin, Chien-Cheng
Format: Article
Language:English
Subjects:
BONDING
Brazed joints
Brazing
COPPER ALLOYS (40 TO 99.3 CU)
Diffusion welding
INTERLAYERS
JOINTS
MICROSTRUCTURES
Phase diagrams
Titanium
WELDING
Zirconium dioxide
ZIRCONIUM OXIDE
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Summary:In this study, 3 mol% Y2O3-stabilized zirconia (3YZrO2) and commercially pure titanium (cp-Ti) joints were fabricated with an Ag68.8Cu26.7Ti4.5 interlayer (Ticusil) at 900 DGC for various brazing periods. After brazing at 900 DGC/0.1 h, Ti2Cu, TiCu, Ti3Cu4, and TiCu4 layers were present at the Ti/Ticusil interface, while TiCu and TiO layers were observed at the Ticusil/3YZrO2 interface. In the residual interlayer, clumpy TiCu4 was formed along with the Ag solid phase. After brazing at 900 DGC/1 h, Ti3Cu3O and Ti2O layers were formed at the interlayer/ZrO2 interface, while Cu2O was precipitated in the residual interlayer with and . After brazing at 900 DGC/6 h, a two-phase (-Ti + Ti2Cu) region was observed on the Ti side with and , while the TiCu layer grew at the expense of Ti3Cu4 and TiCu4. The bonding mechanisms and diffusion paths were explored with the aid of AgCuTi and TiCuO ternary phase diagrams.
ISSN:0884-2914
2044-5326
DOI:10.1557/jmr.2014.30