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Thermal warpage of a glass substrate during Xe-arc flash lamp crystallization of amorphous silicon thin-film
Thermal warpage of a glass substrate after a flash lamp annealing process for crystallization of amorphous silicon thin-film is critical to subsequent fabrication processes for manufacturing large-scale displays. This phenomenon is understood through the structural mismatching of hypothetical two-la...
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Published in: | International journal of thermal sciences 2014-09, Vol.83 (83), p.25-32 |
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container_issue | 83 |
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container_title | International journal of thermal sciences |
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creator | Jin, Won-Beom Park, Yeonsoo Kim, Byung-Kuk Kim, Hyoung June Hwang, Jin-Ha Chung, Haseung Park, Jong Hyeon Kim, Dong Hyun Park, Seungho |
description | Thermal warpage of a glass substrate after a flash lamp annealing process for crystallization of amorphous silicon thin-film is critical to subsequent fabrication processes for manufacturing large-scale displays. This phenomenon is understood through the structural mismatching of hypothetical two-layers in a homogeneous glass structure: thermally softened and uninfluenced, and is mechanistically different from that induced by the mismatch in coefficients of thermal expansions among heterogeneous thin-film structures. Thin subsurface region experiencing the intensified heating is softened, the stress in the region is relaxed, and finally the softened region is shrunk laterally, while uninfluenced part of the substrate remains as it is. The model assumes that the shrunk subsurface layer, of which the thickness is proportional to the thermal penetration, is bonded to the uninfluenced part completely. Due to structural mismatching the substrate is deformed considerably and warped towards the light source (the flash lamp) according to the curvature-flash duration relationship, γ = C2η(1 − C1η1/2). This relationship is confirmed by numerical simulation results based on a viscoelastic model and by experimental observations.
[Display omitted]
•Warpages of a large-window glass backplane during flash lamp annealing processes.•Simulation using a viscoelastic model and experimentation using Xe-arc flashes.•Structural shrinkage due to stress relaxations accompanied by glass-softening.•Gravitational self-loading of the backplane.•The curvature of deformation and flash duration relationship: γ = C2η(1 − C1η1/2). |
doi_str_mv | 10.1016/j.ijthermalsci.2014.04.007 |
format | article |
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[Display omitted]
•Warpages of a large-window glass backplane during flash lamp annealing processes.•Simulation using a viscoelastic model and experimentation using Xe-arc flashes.•Structural shrinkage due to stress relaxations accompanied by glass-softening.•Gravitational self-loading of the backplane.•The curvature of deformation and flash duration relationship: γ = C2η(1 − C1η1/2).</description><identifier>ISSN: 1290-0729</identifier><identifier>EISSN: 1778-4166</identifier><identifier>DOI: 10.1016/j.ijthermalsci.2014.04.007</identifier><language>eng</language><publisher>Kidlington: Elsevier Masson SAS</publisher><subject>Amorphous silicon ; Applied sciences ; Crystallization ; Electronics ; Exact sciences and technology ; Flash lamp crystallization ; Flash lamps ; Glass softening ; Heating ; LTPS ; Mathematical models ; Microelectronic fabrication (materials and surfaces technology) ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Silicon substrates ; Thermal expansion ; Thermal warpage ; Thin films ; Transistors ; Warpage</subject><ispartof>International journal of thermal sciences, 2014-09, Vol.83 (83), p.25-32</ispartof><rights>2014 Elsevier Masson SAS</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c387t-368263778c377280cbfe81cb824123a42a238308e366821985c15cb6d251dd013</citedby><cites>FETCH-LOGICAL-c387t-368263778c377280cbfe81cb824123a42a238308e366821985c15cb6d251dd013</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=28525919$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Jin, Won-Beom</creatorcontrib><creatorcontrib>Park, Yeonsoo</creatorcontrib><creatorcontrib>Kim, Byung-Kuk</creatorcontrib><creatorcontrib>Kim, Hyoung June</creatorcontrib><creatorcontrib>Hwang, Jin-Ha</creatorcontrib><creatorcontrib>Chung, Haseung</creatorcontrib><creatorcontrib>Park, Jong Hyeon</creatorcontrib><creatorcontrib>Kim, Dong Hyun</creatorcontrib><creatorcontrib>Park, Seungho</creatorcontrib><title>Thermal warpage of a glass substrate during Xe-arc flash lamp crystallization of amorphous silicon thin-film</title><title>International journal of thermal sciences</title><description>Thermal warpage of a glass substrate after a flash lamp annealing process for crystallization of amorphous silicon thin-film is critical to subsequent fabrication processes for manufacturing large-scale displays. This phenomenon is understood through the structural mismatching of hypothetical two-layers in a homogeneous glass structure: thermally softened and uninfluenced, and is mechanistically different from that induced by the mismatch in coefficients of thermal expansions among heterogeneous thin-film structures. Thin subsurface region experiencing the intensified heating is softened, the stress in the region is relaxed, and finally the softened region is shrunk laterally, while uninfluenced part of the substrate remains as it is. The model assumes that the shrunk subsurface layer, of which the thickness is proportional to the thermal penetration, is bonded to the uninfluenced part completely. Due to structural mismatching the substrate is deformed considerably and warped towards the light source (the flash lamp) according to the curvature-flash duration relationship, γ = C2η(1 − C1η1/2). This relationship is confirmed by numerical simulation results based on a viscoelastic model and by experimental observations.
[Display omitted]
•Warpages of a large-window glass backplane during flash lamp annealing processes.•Simulation using a viscoelastic model and experimentation using Xe-arc flashes.•Structural shrinkage due to stress relaxations accompanied by glass-softening.•Gravitational self-loading of the backplane.•The curvature of deformation and flash duration relationship: γ = C2η(1 − C1η1/2).</description><subject>Amorphous silicon</subject><subject>Applied sciences</subject><subject>Crystallization</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Flash lamp crystallization</subject><subject>Flash lamps</subject><subject>Glass softening</subject><subject>Heating</subject><subject>LTPS</subject><subject>Mathematical models</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Silicon substrates</subject><subject>Thermal expansion</subject><subject>Thermal warpage</subject><subject>Thin films</subject><subject>Transistors</subject><subject>Warpage</subject><issn>1290-0729</issn><issn>1778-4166</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2014</creationdate><recordtype>article</recordtype><recordid>eNqNkFtLAzEQhRdRsFb_QxAEX3ZNsresb1KvUPClgm9hNpttU7IXk1Spv96pFfFRGJKQfOfM5ETROaMJo6y4WidmHVbadWC9MgmnLEsoFi0PogkrSxFnrCgO8cwrGtOSV8fRifdrikRFq0lkF3s1-QA3wlKToSVAlha8J35T--AgaNJsnOmX5FXH4BRp8XVFLHQjUW7rA1hrPiGYof9Wd4MbV8MG9cYahZdhZfq4NbY7jY5aHFSf_ezT6OX-bjF7jOfPD0-zm3msUlGGOC0EL1IcXuHCBVV1qwVTteAZ4ylkHHgqUip0WiDJKpErlqu6aHjOmoaydBpd7n1HN7xttA-yM15pa6HXOJhkec5ohRns0Os9qtzgvdOtHJ3pwG0lo3IXsVzLvxHLXcSSYtESxRc_fcArsK2DXhn_68BFzvOKVcjd7jmNn3432kl00r3SjXFaBdkM5j_tvgAKD5kw</recordid><startdate>20140901</startdate><enddate>20140901</enddate><creator>Jin, Won-Beom</creator><creator>Park, Yeonsoo</creator><creator>Kim, Byung-Kuk</creator><creator>Kim, Hyoung June</creator><creator>Hwang, Jin-Ha</creator><creator>Chung, Haseung</creator><creator>Park, Jong Hyeon</creator><creator>Kim, Dong Hyun</creator><creator>Park, Seungho</creator><general>Elsevier Masson SAS</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7TB</scope><scope>7U5</scope><scope>8FD</scope><scope>FR3</scope><scope>H8D</scope><scope>KR7</scope><scope>L7M</scope></search><sort><creationdate>20140901</creationdate><title>Thermal warpage of a glass substrate during Xe-arc flash lamp crystallization of amorphous silicon thin-film</title><author>Jin, Won-Beom ; Park, Yeonsoo ; Kim, Byung-Kuk ; Kim, Hyoung June ; Hwang, Jin-Ha ; Chung, Haseung ; Park, Jong Hyeon ; Kim, Dong Hyun ; Park, Seungho</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c387t-368263778c377280cbfe81cb824123a42a238308e366821985c15cb6d251dd013</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2014</creationdate><topic>Amorphous silicon</topic><topic>Applied sciences</topic><topic>Crystallization</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Flash lamp crystallization</topic><topic>Flash lamps</topic><topic>Glass softening</topic><topic>Heating</topic><topic>LTPS</topic><topic>Mathematical models</topic><topic>Microelectronic fabrication (materials and surfaces technology)</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Silicon substrates</topic><topic>Thermal expansion</topic><topic>Thermal warpage</topic><topic>Thin films</topic><topic>Transistors</topic><topic>Warpage</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Jin, Won-Beom</creatorcontrib><creatorcontrib>Park, Yeonsoo</creatorcontrib><creatorcontrib>Kim, Byung-Kuk</creatorcontrib><creatorcontrib>Kim, Hyoung June</creatorcontrib><creatorcontrib>Hwang, Jin-Ha</creatorcontrib><creatorcontrib>Chung, Haseung</creatorcontrib><creatorcontrib>Park, Jong Hyeon</creatorcontrib><creatorcontrib>Kim, Dong Hyun</creatorcontrib><creatorcontrib>Park, Seungho</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>Aerospace Database</collection><collection>Civil Engineering Abstracts</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>International journal of thermal sciences</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Jin, Won-Beom</au><au>Park, Yeonsoo</au><au>Kim, Byung-Kuk</au><au>Kim, Hyoung June</au><au>Hwang, Jin-Ha</au><au>Chung, Haseung</au><au>Park, Jong Hyeon</au><au>Kim, Dong Hyun</au><au>Park, Seungho</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Thermal warpage of a glass substrate during Xe-arc flash lamp crystallization of amorphous silicon thin-film</atitle><jtitle>International journal of thermal sciences</jtitle><date>2014-09-01</date><risdate>2014</risdate><volume>83</volume><issue>83</issue><spage>25</spage><epage>32</epage><pages>25-32</pages><issn>1290-0729</issn><eissn>1778-4166</eissn><abstract>Thermal warpage of a glass substrate after a flash lamp annealing process for crystallization of amorphous silicon thin-film is critical to subsequent fabrication processes for manufacturing large-scale displays. This phenomenon is understood through the structural mismatching of hypothetical two-layers in a homogeneous glass structure: thermally softened and uninfluenced, and is mechanistically different from that induced by the mismatch in coefficients of thermal expansions among heterogeneous thin-film structures. Thin subsurface region experiencing the intensified heating is softened, the stress in the region is relaxed, and finally the softened region is shrunk laterally, while uninfluenced part of the substrate remains as it is. The model assumes that the shrunk subsurface layer, of which the thickness is proportional to the thermal penetration, is bonded to the uninfluenced part completely. Due to structural mismatching the substrate is deformed considerably and warped towards the light source (the flash lamp) according to the curvature-flash duration relationship, γ = C2η(1 − C1η1/2). This relationship is confirmed by numerical simulation results based on a viscoelastic model and by experimental observations.
[Display omitted]
•Warpages of a large-window glass backplane during flash lamp annealing processes.•Simulation using a viscoelastic model and experimentation using Xe-arc flashes.•Structural shrinkage due to stress relaxations accompanied by glass-softening.•Gravitational self-loading of the backplane.•The curvature of deformation and flash duration relationship: γ = C2η(1 − C1η1/2).</abstract><cop>Kidlington</cop><pub>Elsevier Masson SAS</pub><doi>10.1016/j.ijthermalsci.2014.04.007</doi><tpages>8</tpages></addata></record> |
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subjects | Amorphous silicon Applied sciences Crystallization Electronics Exact sciences and technology Flash lamp crystallization Flash lamps Glass softening Heating LTPS Mathematical models Microelectronic fabrication (materials and surfaces technology) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Silicon substrates Thermal expansion Thermal warpage Thin films Transistors Warpage |
title | Thermal warpage of a glass substrate during Xe-arc flash lamp crystallization of amorphous silicon thin-film |
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