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Determining the Resolution Limits of Electron-Beam Lithography: Direct Measurement of the Point-Spread Function

One challenge existing since the invention of electron-beam lithography (EBL) is understanding the exposure mechanisms that limit the resolution of EBL. To overcome this challenge, we need to understand the spatial distribution of energy density deposited in the resist, that is, the point-spread fun...

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Bibliographic Details
Published in:Nano letters 2014-08, Vol.14 (8), p.4406-4412
Main Authors: Manfrinato, Vitor R, Wen, Jianguo, Zhang, Lihua, Yang, Yujia, Hobbs, Richard G, Baker, Bowen, Su, Dong, Zakharov, Dmitri, Zaluzec, Nestor J, Miller, Dean J, Stach, Eric A, Berggren, Karl K
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Language:English
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Summary:One challenge existing since the invention of electron-beam lithography (EBL) is understanding the exposure mechanisms that limit the resolution of EBL. To overcome this challenge, we need to understand the spatial distribution of energy density deposited in the resist, that is, the point-spread function (PSF). During EBL exposure, the processes of electron scattering, phonon, photon, plasmon, and electron emission in the resist are combined, which complicates the analysis of the EBL PSF. Here, we show the measurement of delocalized energy transfer in EBL exposure by using chromatic aberration-corrected energy-filtered transmission electron microscopy (EFTEM) at the sub-10 nm scale. We have defined the role of spot size, electron scattering, secondary electrons, and volume plasmons in the lithographic PSF by performing EFTEM, momentum-resolved electron energy loss spectroscopy (EELS), sub-10 nm EBL, and Monte Carlo simulations. We expect that these results will enable alternative ways to improve the resolution limit of EBL. Furthermore, our approach to study the resolution limits of EBL may be applied to other lithographic techniques where electrons also play a key role in resist exposure, such as ion-beam-, X-ray-, and extreme-ultraviolet lithography.
ISSN:1530-6984
1530-6992
DOI:10.1021/nl5013773