A thin film encapsulation layer fabricated via initiated chemical vapor deposition and atomic layer deposition

ABSTRACT An organic/inorganic hybrid multilayer for encapsulation of organic electronic devices is developed, where the organic polymer layer and the inorganic layer are alternatively deposited by initiated chemical vapor deposition and atomic layer deposition processes, respectively. The thickness...

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Bibliographic Details
Published in:Journal of applied polymer science 2014-12, Vol.131 (24), p.n/a
Main Authors: Kim, Bong Jun, Kim, Do Heung, Kang, Seung Youl, Ahn, Seong Deok, Im, Sung Gap
Format: Article
Language:English
Subjects:
Chemical vapor deposition
Deposition
Electronic devices
Elongation
Encapsulation
Equivalence
Materials science
Multilayers
Polymers
property relations
radical polymerization
structure
Thin films
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Summary:ABSTRACT An organic/inorganic hybrid multilayer for encapsulation of organic electronic devices is developed, where the organic polymer layer and the inorganic layer are alternatively deposited by initiated chemical vapor deposition and atomic layer deposition processes, respectively. The thickness of each organic and inorganic layer is optimized to minimize the water vapor transmission rate (WVTR) determined by a Ca test. The produced barrier film shows an outstanding optical property as its light transmittance is average 89.42% at visible light region. The WVTR of the developed thin film encapsulation layer is as low as 2.17 × 10−4 g m−2 day−1 at 38oC, 90% relative humidity (RH). This value is equivalent to 1.29 × 10−5 g m−2 day−1 at ambient condition, which is sufficient to elongate the lifetime of organic electronic devices. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014, 131, 40974.
ISSN:0021-8995
1097-4628
DOI:10.1002/app.40974