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Development of electroplated Ni–xZn films for under bump metallization application
The feasibility of using electroplated Ni–xZn films was evaluated for a new application as the under bump metallization. Considering the alloy films in electroplating process, determining the deposition potential (affecting nucleation) and current density (affecting growth) is crucial. A suitable Ni...
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Published in: | Surface & coatings technology 2013-12, Vol.237, p.445-449 |
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Main Authors: | , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites |
Online Access: | Get full text |
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Summary: | The feasibility of using electroplated Ni–xZn films was evaluated for a new application as the under bump metallization. Considering the alloy films in electroplating process, determining the deposition potential (affecting nucleation) and current density (affecting growth) is crucial. A suitable Ni–5Zn film exhibiting smooth and dense surface was derived at a low current density of 0.067ASD. After a 30s liquid reaction, intermetallic phase formation and Cu6Sn5 growth at the interface were visualized and analyzed using a field-emission electron probe microanalyzer. This study demonstrated that binary Ni–Zn films fabricated by electroplating might be a potential candidate for under bump metallization application.
•New application of electroplating Ni–Zn films have been developed as the novel UBM.•Ni-rich Zn films are successfully derived at the lower potential and current density.•Smooth and dense Ni–5Zn film revealed via the lower constant current density process. |
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ISSN: | 0257-8972 1879-3347 |
DOI: | 10.1016/j.surfcoat.2013.08.056 |