Qualification of encapsulation materials for module-level-processing

Module-level-processing applies cell processing and/or cell interconnection processes while the silicon wafers are attached to a sub- or superstrate, such as the module glass. This thin-film/wafer-hybrid- silicon (HySi) approach offers unique possibilities when using ultra-thin silicon wafers that c...

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Bibliographic Details
Published in:Solar energy materials and solar cells 2014-01, Vol.120, p.396-401
Main Authors: Steckenreiter, Verena, Horbelt, Renate, Wright, Daniel Nilsen, Nese, Martin, Brendel, Rolf
Format: Article
Language:English
Subjects:
Adhesives
Applied sciences
Electrical engineering. Electrical power engineering
Exact sciences and technology
Glass
Liquids
Module-level-processing
Modules
Outgassing
PECVD process
Silicon
Silicones
Substrate
Testing. Reliability. Quality control
Thin Si layers
Wafer-hybrid-Si technology
Wafers
Warranties
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Summary:Module-level-processing applies cell processing and/or cell interconnection processes while the silicon wafers are attached to a sub- or superstrate, such as the module glass. This thin-film/wafer-hybrid- silicon (HySi) approach offers unique possibilities when using ultra-thin silicon wafers that can hardly be processed free-standing. Liquid adhesives are one option for attaching the wafers to the module glass. Here, we analyze the compatibility of a selection of adhesives with module-level processing. The adhesives have to be stable during wet chemical steps and during thermal treatments. A further requirement is that outgassing from the adhesives should be sufficiently low to allow efficient surface passivation by e.g. plasma enhanced chemical vapor deposition. The adhesives have to withstand UV-irradiation and thermal exposure in order to fulfill warranty requirements. In this work we develop and apply tests for the screening of adhesives. We find that certain liquid addition-curing 2-part silicones pass all the tests and are thus attractive candidates for module-level-processing. •Addition-curing 2-part silicones passed pre-screening for module-level-processing.•Reduced impact on passivation quality from silicones by pre-outgassing of the glued samples.•In PECVD-process Srear=(2.5±1.5) cm/s of sample glued with silicone after pre-outgassing.
ISSN:0927-0248
1879-3398
DOI:10.1016/j.solmat.2013.06.012