A Novel Nanoparticles Activation Technique for Electroless Plating on ABS Plastic

This paper reports a novel and facile activation process for electroless copper plating on Acrylonitrile Butadiene Styrene (ABS) plastic substrate using gold nanoparticles as catalyst. Gold nanoparticles were prepared by chemical reduction method and characterized by UVvisible adsorption spectrum an...

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Bibliographic Details
Published in:Key engineering materials 2014-04, Vol.609-610, p.55-63
Main Authors: Ma, Fang, Sun, Hua, Zhang, Chang Cun, Wang, Xiaor Rui, Jiang, Rong Yan, Ma, Hong Fang
Format: Article
Language:English
Subjects:
ABS
ABS resins
Activation
Copper
Electroless copper plating
Gold
Nanoparticles
Scanning electron microscopy
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Summary:This paper reports a novel and facile activation process for electroless copper plating on Acrylonitrile Butadiene Styrene (ABS) plastic substrate using gold nanoparticles as catalyst. Gold nanoparticles were prepared by chemical reduction method and characterized by UVvisible adsorption spectrum and transmission electron microscope (TEM). The gold nanoparticles were sphere-like with a size of less than 50 nm. Gold nanoparticles were adsorbed on ABS surface and acted as nucleation centers in activating process of the electroless copper plating. The uniform and dense film was obtained at the optimal technological parameters which were achieved by the orthogonal experiment. The scanning electron microscope (SEM), energy dispersive spectrometer (EDS), X-ray diffractometer (XRD) and X-ray photoelectron spectroscopy (XPS) were used to detect the morphology, structure and elemental composition of the coating, respectively. The results indicated that copper coating contained only Cu (0) without any other elements.
ISSN:1013-9826
1662-9795
1662-9795
DOI:10.4028/www.scientific.net/KEM.609-610.55