Thermal and mechanical effects of voids within flip chip soldering in LED packages

This paper investigates the effect of void percentage in the solder layer on the shear strength and thermal property of DA3547 packages by SAC soldering technology. X-ray observation and shear tests revealed that the increase of solder paste volume significantly decreases the void percentage in the...

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Bibliographic Details
Published in:Microelectronics and reliability 2014-09, Vol.54 (9-10), p.2028-2033
Main Authors: Liu, Yang, Leung, Stanley Y.Y., Zhao, Jia, Wong, Cell K.Y., Yuan, Cadmus A., Zhang, Guoqi, Sun, Fenglian, Luo, Liangliang
Format: Article
Language:English
Subjects:
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Flip–chip LED
Integrated circuits
Mathematical analysis
Packages
Pastes
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Shear strength
Shear tests
Simulation
Soldering
Solders
Thermal properties
Voids
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Summary:This paper investigates the effect of void percentage in the solder layer on the shear strength and thermal property of DA3547 packages by SAC soldering technology. X-ray observation and shear tests revealed that the increase of solder paste volume significantly decreases the void percentage in the solder layer and thus improved the shear strength of the packages. Furthermore, packages with lower void percentage showed a lower junction temperature based on the results of IR test and finite element simulation. The temperature difference due to the effect void percentage shows a correlation with the input power. For the DA3547 packages studied in this research, voids show limited influence on the junction temperature under 50mA, the typical current recommended by Cree.
ISSN:0026-2714
1872-941X
DOI:10.1016/j.microrel.2014.07.034