Annealing free, clean graphene transfer using alternative polymer scaffolds

We examine the transfer of graphene grown by chemical vapor deposition (CVD) with polymer scaffolds of poly(methyl methacrylate) (PMMA), poly(lactic acid) (PLA), poly(phthalaldehyde) (PPA), and poly(bisphenol A carbonate) (PC). We find that optimally reactive PC scaffolds provide the cleanest graphe...

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Bibliographic Details
Published in:Nanotechnology 2015-02, Vol.26 (5), p.055302-055302
Main Authors: Wood, Joshua D, Doidge, Gregory P, Carrion, Enrique A, Koepke, Justin C, Kaitz, Joshua A, Datye, Isha, Behnam, Ashkan, Hewaparakrama, Jayan, Aruin, Basil, Chen, Yaofeng, Dong, Hefei, Haasch, Richard T, Lyding, Joseph W, Pop, Eric
Format: Article
Language:English
Subjects:
Annealing
Benzhydryl Compounds - chemistry
Biomolecules
Boron Compounds - chemistry
Chemical vapor deposition
Cleaning
contaminants
Electronics
Graphene
Graphite - chemistry
Lactic Acid - chemistry
layering
Microscopy, Atomic Force
Microscopy, Scanning Tunneling
Nanostructures - chemistry
Photoelectron Spectroscopy
Polyesters
polymers
Polymers - chemistry
Polymethyl Methacrylate - chemistry
Polymethyl methacrylates
Scaffolds
transfer
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Summary:We examine the transfer of graphene grown by chemical vapor deposition (CVD) with polymer scaffolds of poly(methyl methacrylate) (PMMA), poly(lactic acid) (PLA), poly(phthalaldehyde) (PPA), and poly(bisphenol A carbonate) (PC). We find that optimally reactive PC scaffolds provide the cleanest graphene transfers without any annealing, after extensive comparison with optical microscopy, x-ray photoelectron spectroscopy, atomic force microscopy, and scanning tunneling microscopy. Comparatively, films transferred with PLA, PPA, PMMA PC, and PMMA have a two-fold higher roughness and a five-fold higher chemical doping. Using PC scaffolds, we demonstrate the clean transfer of CVD multilayer graphene, fluorinated graphene, and hexagonal boron nitride. Our annealing free, PC transfers enable the use of atomically-clean nanomaterials in biomolecule encapsulation and flexible electronic applications.
ISSN:0957-4484
1361-6528
DOI:10.1088/0957-4484/26/5/055302