Residual stress in self-healing microcapsule-loaded epoxy

In this study, photoelastic method was used to investigate the residual stress in self-healing microcapsule-loaded epoxy. Photoelastic images show that the compressive residual stress exists in the region around the microcapsule. The shrinkage deformation of the epoxy matrix during the curing proces...

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Bibliographic Details
Published in:Materials letters 2014-12, Vol.137, p.9-12
Main Authors: Zhang, Xiao-Chuan, Ji, Hong-Wei, Qiao, Zhi-Xia
Format: Article
Language:English
Subjects:
Compressive properties
Crack propagation
Curing
Deformation and fracture
Fracture mechanics
Functional
Photoelastic
Polymeric composites
Residual stress
Rupture
Shrinkage
Stress concentration
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Summary:In this study, photoelastic method was used to investigate the residual stress in self-healing microcapsule-loaded epoxy. Photoelastic images show that the compressive residual stress exists in the region around the microcapsule. The shrinkage deformation of the epoxy matrix during the curing process is responsible for this residual stress. A tensile test was carried out on a self-healing microcapsule-loaded epoxy specimen with a precrack. The crack in the specimen propagated to rupture the microcapsule, which shows that the stress concentration induced by the inclusion is the main factor to affect the crack growth path and the residual stress is not important in the tensile fracture of the self-healing microcapsule-loaded epoxy specimen. •The residual stress distribution in self-healing microcapsule-loaded epoxy was observed.•The cause of residual stress was discussed.•The effect of the residual stress on the crack propagation of self-healing microcapsule-loaded epoxy was investigated.
ISSN:0167-577X
1873-4979
DOI:10.1016/j.matlet.2014.08.075