70.5L: Late-News Paper: Low Temperature Curable Cu Ink and Fine Inkjet-printed Patterning

Cu wiring patterns of fine pitch less than 20 μm have been successfully achieved by inkjet printing technology with the assistance of surface energy controlled patterns formed by the exposure of ordinary ultrahigh pressure mercury lamp. The curing condition of Cu ink is as mild as 150°C in non‐reduc...

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Bibliographic Details
Published in:SID International Symposium Digest of technical papers 2013-06, Vol.44 (1), p.458-460
Main Authors: Fukuda, Miyako, Ito, Masahiro, Tsuruoka, Kaori, Kuwana, Yasuhiro, Kashiwabara, Satoshi, Hirakoso, Hideyuki, Tagashira, Osamu
Format: Article
Language:English
Subjects:
ATMOSPHERES
Copper
Cu ink
CURING
dielectrics
fine pitch wiring
Inkjet printing
INKS
LAMPS
Mercury lamps
Patterning
SURFACE ENERGY
surface energy control
Technical papers
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Description
Summary:Cu wiring patterns of fine pitch less than 20 μm have been successfully achieved by inkjet printing technology with the assistance of surface energy controlled patterns formed by the exposure of ordinary ultrahigh pressure mercury lamp. The curing condition of Cu ink is as mild as 150°C in non‐reducing atmosphere.
ISSN:0097-966X
2168-0159
DOI:10.1002/j.2168-0159.2013.tb06246.x