Connectivity between electrical conduction and electrode structure in Mn–Co–Ni–O thick-film thermistors

In this paper, the electrical conduction of grain and grain boundary (GB) in Mn 1.85 Co 0.3 Ni 0.85 O 4 negative-temperature-coefficient (NTC) thick-film thermistors with different finger electrode structures was studied carefully through the temperature-dependent ac impedance spectroscopy analyzing...

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Bibliographic Details
Published in:Applied physics. A, Materials science & processing Materials science & processing, 2015-01, Vol.118 (1), p.177-182
Main Authors: He, L., Ling, Z. Y., Zhang, G.
Format: Article
Language:English
Subjects:
Characterization and Evaluation of Materials
Condensed Matter Physics
Electrical conduction
Electrodes
Fingers
Grain boundaries
Grains
Machines
Manganese
Manufacturing
Nanotechnology
Optical and Electronic Materials
Physics
Physics and Astronomy
Processes
Surfaces and Interfaces
Thermistors
Thin Films
Transformations
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Summary:In this paper, the electrical conduction of grain and grain boundary (GB) in Mn 1.85 Co 0.3 Ni 0.85 O 4 negative-temperature-coefficient (NTC) thick-film thermistors with different finger electrode structures was studied carefully through the temperature-dependent ac impedance spectroscopy analyzing. It was found that the increase in finger length will drop the resistance of grain and GB sharply. The conduction mechanism of the grain was independent on the electrode structure and followed the small-polaron hopping model. However, the conduction mechanism of GB was dependent on the electrode structure. With the finger length increasing, the resistance–temperature ( R – T ) relation of GB was transformed from nonlinear to linear relation. These studies on the mechanisms concerning the dependence of conduction behaviors of grain and GB on electrode structure will provide a comprehensive understanding on the transformation behaviors of R – T relation of thick-film NTC thermistors.
ISSN:0947-8396
1432-0630
DOI:10.1007/s00339-014-8867-4