Mechanical behavior of Cu/TiN multilayers at ambient and elevated temperatures: Stress-assisted diffusion of Cu

The deformation and failure mechanism of a multilayered thin film consisting of alternating soft Cu and hard TiN interlayers has been studied by in situ SEM compression of micro-pillars and finite element simulations. While the yielding of the multilayer is governed by the 'size-dependent'...

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Bibliographic Details
Published in:Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2015-01, Vol.620, p.375-382
Main Authors: Raghavan, R., Wheeler, J.M., Esqué-de los Ojos, D., Thomas, K., Almandoz, E., Fuentes, G.G., Michler, J.
Format: Article
Language:English
Subjects:
Copper
Diffusion
Electron microscopy
Failure
High temperature
Interfaces
Interlayers
Materials science
Micromechanics
Multilayers
Nanostructured materials
Plasticity
Titanium nitride
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Summary:The deformation and failure mechanism of a multilayered thin film consisting of alternating soft Cu and hard TiN interlayers has been studied by in situ SEM compression of micro-pillars and finite element simulations. While the yielding of the multilayer is governed by the 'size-dependent' strength of Cu, the failure was found to occur by shearing of the columnar grains of TiN. At elevated temperatures of 200 and 400°C, the yielding of the multilayers is governed by the stress-assisted diffusion of the Cu interlayers, which coalesce into microcrystals and grow into larger faceted crystals.
ISSN:0921-5093
1873-4936
DOI:10.1016/j.msea.2014.10.023