The Assembly and Fabrication of Single CuO Nanowire Electronic Device Based on Controllable DWS-DEP Technology

CuO nanowire is an important one-dimensional semiconductor material to assemble and fabricate novel nanoelectronic device, especially molecular or atom device based on single nanowire. However, how to assemble and fabricate nanoelectronic device based on single CuO nanowire remains a big challenge....

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Bibliographic Details
Published in:IEEE transactions on nanotechnology 2015-01, Vol.14 (1), p.101-107
Main Authors: Huang, Chaolei, Tian, Xiaojun, Liu, Jie, Dong, Zaili, Wang, Yuechao
Format: Article
Language:English
Subjects:
ALCOHOLS
Assembly
Automation
COPPER OXIDE
Dielectrophoresi
Dispersions
Electronic devices
ELECTRONIC PRODUCTS
FABRICATION
Force
Microelectrodes
MICROSTRUCTURES
MICROWIRE
Nanoelectronics
Nanofabrication
Nanoscale devices
Nanostructure
Nanotechnology devices
Nanowires
Sensors
Single CuO nanowire
Stability
Substrates
Temperature sensors
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Summary:CuO nanowire is an important one-dimensional semiconductor material to assemble and fabricate novel nanoelectronic device, especially molecular or atom device based on single nanowire. However, how to assemble and fabricate nanoelectronic device based on single CuO nanowire remains a big challenge. Here, we proposed a new controllable dielectrophoresis assembly technology, namely dielectrophoretic working space-dielectrophoresis technology, to realize the assembly and fabrication of single CuO nanowire nanoelectronic device. Theoretical analysis and assembly experiments verified the effectiveness of the new technology. By this technology, currently we have successfully fabricated two kinds of single CuO nanowire nanoelectronic device, photodetector and alcohol sensor, from CuO nanowire's preparation, dispersion to assembly. Due to the high sensitivity of single CuO nanowire, the novel alcohol sensor can work at room temperature compared to the CuO nanowires arrays-based sensor working only at high temperature. The proposed technology can also be utilized to assemble and fabricate single-nanowire electronic device based on other materials.
ISSN:1536-125X
1941-0085
DOI:10.1109/TNANO.2014.2368256