Effects of ultrasonic field in pulse electrodeposition of NiFe film on Cu substrate

NiFe film was pulse electrodeposited on conductive Cu substrate under galvanostatic mode in the presence of an ultrasonic field. The NiFe film electrodeposited was subjected to structural and surface analyses by X-ray diffraction, energy dispersive X-ray spectroscopy, surface profiling and scanning...

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Bibliographic Details
Published in:Journal of alloys and compounds 2009-07, Vol.481 (1), p.336-339
Main Authors: Balachandran, R., Yow, H.K., Ong, B.H., Manickam, R., Saaminathan, V., Tan, K.B.
Format: Article
Language:English
Subjects:
Copper
Cross-disciplinary physics: materials science
rheology
Diffraction
Electrochemical reactions
Electrode materials
ELECTRODEPOSITION
Electrodeposition, electroplating
ELECTRODES
Exact sciences and technology
Grain size
GRAIN SIZE AND SHAPE
INTERMETALLIC COMPOUNDS
Intermetallics
IRON COMPOUNDS
Materials science
Metals and alloys
Methods of deposition of films and coatings
film growth and epitaxy
NICKEL ALLOYS (50 TO 99 NI)
Nickel base alloys
Nickel compounds
Physics
SURFACE FINISH
Surface roughness
ULTRASONICS
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Summary:NiFe film was pulse electrodeposited on conductive Cu substrate under galvanostatic mode in the presence of an ultrasonic field. The NiFe film electrodeposited was subjected to structural and surface analyses by X-ray diffraction, energy dispersive X-ray spectroscopy, surface profiling and scanning electron microscopy, respectively. The results show that the ultrasonic field has significantly improved the surface roughness, reduced the spherical grain size in the range from 490–575 nm to 90–150 nm, and increased the Ni content from 76.08% to 79.74% in the NiFe film electrodeposited.
ISSN:0925-8388
1873-4669
DOI:10.1016/j.jallcom.2009.02.129