Direct-conversion quadrature modulator MMIC design with a new 90/spl deg/ phase shifter including package and PCB effects for W-CDMA applications

This paper presents a wideband code-division multiple-access direct-conversion quadrature modulator monolithic-microwave integrated-circuit (MMIC) design that employs a new technique to generate the 90deg phase shift with low implementation loss. From the bare-chip measurement, this new 90deg phase...

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Bibliographic Details
Published in:IEEE transactions on microwave theory and techniques 2006-06, Vol.54 (6), p.2691-2698
Main Authors: Wu, Jian-Ming, Han, Fu-Yi, Horng, Tzyy-Sheng, Lin, Jenshan
Format: Article
Language:English
Subjects:
Circuit boards
Electromagnetic measurements
Frequency measurement
MMICs
Modulation coding
Modulators
Multiaccess communication
Package and printed circuit board (PCB) effects
Packages
Packaging
Phase error
Phase measurement
Phase modulation
phase shifter
Phase shifters
Printed circuit boards
Printed circuits
quadrature modulator
Quadratures
Sidebands
Studies
Wideband
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Description
Summary:This paper presents a wideband code-division multiple-access direct-conversion quadrature modulator monolithic-microwave integrated-circuit (MMIC) design that employs a new technique to generate the 90deg phase shift with low implementation loss. From the bare-chip measurement, this new 90deg phase shifter has been proven with an amplitude and phase error less than 0.6 dB and 0.8deg, respectively, within the applied frequency range from 1.85 to 1.98 GHz. The package and printed circuit board (PCB) interconnects are also analyzed using the three-dimensional electromagnetic simulation tool and transformed into the equivalent-circuit elements for co-simulation with the designed quadrature modulator MMIC. The degradation of error vector magnitude and sideband suppression due to the package and PCB can be well predicted and verified by measurements. Although the proposed 90deg phase shifter has a remarkable advantage over the others in implementation loss, it is quite susceptible to the package and PCB effects and needs more design efforts to deal with those effects
ISSN:0018-9480
1557-9670
DOI:10.1109/TMTT.2006.874866