Innovative methodology to extract dynamic compact thermal models: Application to power devices

This paper presents a new and innovative methodology for power components manufacturers to generate accurate boundary condition independent dynamic Compact Thermal Models (“BCI” DCTMs). The originality of this methodology is summarized by taking into account the thermal behavior of electronic compon...

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Bibliographic Details
Published in:Microelectronics 2012-09, Vol.43 (9), p.642-648
Main Authors: Azoui, Toufik, Tounsi, Patrick, Dorkel, Jean-Marie
Format: Article
Language:English
Subjects:
Boundary condition independent (BCI)
Boundary conditions
Construction
Dynamic compact thermal model (DCTM)
Equivalence
Methodology
Networks
Optimization
Power devices
Reinforced concrete
Thermal simulation
Three dimensional
VHDL-AMS
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Summary:This paper presents a new and innovative methodology for power components manufacturers to generate accurate boundary condition independent dynamic Compact Thermal Models (“BCI” DCTMs). The originality of this methodology is summarized by taking into account the thermal behavior of electronic components containing several cooling surfaces, and representing the non-linear properties of materials, while keeping a simple and recurring structure of generated models. Moreover, the proposed method makes it possible to obtain DCTMs with a limited number of measurements or 3D thermal simulations. The methodology to construct the DCTM is based on the construction of an equivalent thermal RC network. The precision of the RC thermal network is improved using variable resistances and capacitances related to the heat fluxes so that the compact model can adapt automatically with boundary conditions.
ISSN:1879-2391
0026-2692
1879-2391
DOI:10.1016/j.mejo.2011.09.005