Fast joining of melt textured Y–Ba–Cu–O bulks with high quality

Y–Ba–Cu–O bulk superconductors were fast joined using Ag-doped Y–Ba–Cu–O solder (metallic Ag powder additive). The joining process was relatively shorter (around 24 h) comparing with the traditional joining method. The microstructures and the superconducting properties of the joints were evaluated c...

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Bibliographic Details
Published in:Physica. C, Superconductivity Superconductivity, 2010-07, Vol.470 (13), p.598-601
Main Authors: Chai, Xiao, Zou, Guisheng, Guo, Wei, Wu, Aiping, He, Jiarun, Bai, Hailin, Xiao, Ling, Jiao, Yulei, Jialie, Ren
Format: Article
Language:English
Subjects:
Ag-doped Y–Ba–Cu–O solder
BONDING
Condensed matter: electronic structure, electrical, magnetic, and optical properties
Crystals
Exact sciences and technology
Granular, melt-textured, amorphous and composite superconductors
Inhomogeneous superconductors and superconducting systems
JOINING
Melts
Microstructure
MICROSTRUCTURES
Physics
Silver
SUPERCONDUCTIVITY
Yttrium
YTTRIUM OXIDE
Y–Ba–Cu–O superconducting bulks
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Summary:Y–Ba–Cu–O bulk superconductors were fast joined using Ag-doped Y–Ba–Cu–O solder (metallic Ag powder additive). The joining process was relatively shorter (around 24 h) comparing with the traditional joining method. The microstructures and the superconducting properties of the joints were evaluated carefully. Microstructure analysis revealed that the crystal pattern in the joint was almost the same as that of the base material. This indicated that the bonding zone grew along the growth direction of the base material. The trapped-field distribution of the joined bulk was almost uniform and only single peak was found. This demonstrated that strong bonding was achieved in the joining process. The ratio of joined bulk’s levitation force to that of original base material was up to 93.5%.
ISSN:0921-4534
1873-2143
DOI:10.1016/j.physc.2010.05.236