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Fast joining of melt textured Y–Ba–Cu–O bulks with high quality
Y–Ba–Cu–O bulk superconductors were fast joined using Ag-doped Y–Ba–Cu–O solder (metallic Ag powder additive). The joining process was relatively shorter (around 24 h) comparing with the traditional joining method. The microstructures and the superconducting properties of the joints were evaluated c...
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| Published in: | Physica. C, Superconductivity Superconductivity, 2010-07, Vol.470 (13), p.598-601 |
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| Main Authors: | , , , , , , , , |
| Format: | Article |
| Language: | English |
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| cited_by | cdi_FETCH-LOGICAL-c366t-57dc8751178d850407411c15e44e9475f9e1a4584f0754c37e39d4c798823353 |
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| cites | cdi_FETCH-LOGICAL-c366t-57dc8751178d850407411c15e44e9475f9e1a4584f0754c37e39d4c798823353 |
| container_end_page | 601 |
| container_issue | 13 |
| container_start_page | 598 |
| container_title | Physica. C, Superconductivity |
| container_volume | 470 |
| creator | Chai, Xiao Zou, Guisheng Guo, Wei Wu, Aiping He, Jiarun Bai, Hailin Xiao, Ling Jiao, Yulei Jialie, Ren |
| description | Y–Ba–Cu–O bulk superconductors were fast joined using Ag-doped Y–Ba–Cu–O solder (metallic Ag powder additive). The joining process was relatively shorter (around 24
h) comparing with the traditional joining method. The microstructures and the superconducting properties of the joints were evaluated carefully. Microstructure analysis revealed that the crystal pattern in the joint was almost the same as that of the base material. This indicated that the bonding zone grew along the growth direction of the base material. The trapped-field distribution of the joined bulk was almost uniform and only single peak was found. This demonstrated that strong bonding was achieved in the joining process. The ratio of joined bulk’s levitation force to that of original base material was up to 93.5%. |
| doi_str_mv | 10.1016/j.physc.2010.05.236 |
| format | article |
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h) comparing with the traditional joining method. The microstructures and the superconducting properties of the joints were evaluated carefully. Microstructure analysis revealed that the crystal pattern in the joint was almost the same as that of the base material. This indicated that the bonding zone grew along the growth direction of the base material. The trapped-field distribution of the joined bulk was almost uniform and only single peak was found. This demonstrated that strong bonding was achieved in the joining process. The ratio of joined bulk’s levitation force to that of original base material was up to 93.5%.</description><identifier>ISSN: 0921-4534</identifier><identifier>EISSN: 1873-2143</identifier><identifier>DOI: 10.1016/j.physc.2010.05.236</identifier><language>eng</language><publisher>Amsterdam: Elsevier B.V</publisher><subject>Ag-doped Y–Ba–Cu–O solder ; BONDING ; Condensed matter: electronic structure, electrical, magnetic, and optical properties ; Crystals ; Exact sciences and technology ; Granular, melt-textured, amorphous and composite superconductors ; Inhomogeneous superconductors and superconducting systems ; JOINING ; Melts ; Microstructure ; MICROSTRUCTURES ; Physics ; Silver ; SUPERCONDUCTIVITY ; Yttrium ; YTTRIUM OXIDE ; Y–Ba–Cu–O superconducting bulks</subject><ispartof>Physica. C, Superconductivity, 2010-07, Vol.470 (13), p.598-601</ispartof><rights>2010 Elsevier B.V.</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c366t-57dc8751178d850407411c15e44e9475f9e1a4584f0754c37e39d4c798823353</citedby><cites>FETCH-LOGICAL-c366t-57dc8751178d850407411c15e44e9475f9e1a4584f0754c37e39d4c798823353</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=23000136$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Chai, Xiao</creatorcontrib><creatorcontrib>Zou, Guisheng</creatorcontrib><creatorcontrib>Guo, Wei</creatorcontrib><creatorcontrib>Wu, Aiping</creatorcontrib><creatorcontrib>He, Jiarun</creatorcontrib><creatorcontrib>Bai, Hailin</creatorcontrib><creatorcontrib>Xiao, Ling</creatorcontrib><creatorcontrib>Jiao, Yulei</creatorcontrib><creatorcontrib>Jialie, Ren</creatorcontrib><title>Fast joining of melt textured Y–Ba–Cu–O bulks with high quality</title><title>Physica. C, Superconductivity</title><description>Y–Ba–Cu–O bulk superconductors were fast joined using Ag-doped Y–Ba–Cu–O solder (metallic Ag powder additive). The joining process was relatively shorter (around 24
h) comparing with the traditional joining method. The microstructures and the superconducting properties of the joints were evaluated carefully. Microstructure analysis revealed that the crystal pattern in the joint was almost the same as that of the base material. This indicated that the bonding zone grew along the growth direction of the base material. The trapped-field distribution of the joined bulk was almost uniform and only single peak was found. This demonstrated that strong bonding was achieved in the joining process. The ratio of joined bulk’s levitation force to that of original base material was up to 93.5%.</description><subject>Ag-doped Y–Ba–Cu–O solder</subject><subject>BONDING</subject><subject>Condensed matter: electronic structure, electrical, magnetic, and optical properties</subject><subject>Crystals</subject><subject>Exact sciences and technology</subject><subject>Granular, melt-textured, amorphous and composite superconductors</subject><subject>Inhomogeneous superconductors and superconducting systems</subject><subject>JOINING</subject><subject>Melts</subject><subject>Microstructure</subject><subject>MICROSTRUCTURES</subject><subject>Physics</subject><subject>Silver</subject><subject>SUPERCONDUCTIVITY</subject><subject>Yttrium</subject><subject>YTTRIUM OXIDE</subject><subject>Y–Ba–Cu–O superconducting bulks</subject><issn>0921-4534</issn><issn>1873-2143</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2010</creationdate><recordtype>article</recordtype><recordid>eNp9kL9OwzAQxi0EEuXPE7B4QWJJ8cV2nAwMULWAhNSFhckyzoW6pElrO0A33oE35ElIW8TIDd9Jp-_u0_0IOQM2BAbZ5Xy4nK2DHaasnzA5THm2RwaQK56kIPg-GbAihURILg7JUQhz1hcUMCDjiQmRzlvXuOaFthVdYB1pxI_YeSzp0_fn143pZdT1MqXPXf0a6LuLMzpzLzO66kzt4vqEHFSmDnj624_J42T8OLpLHqa396Prh8TyLIuJVKXNlQRQeZlLJpgSABYkCoGFULIqEIyQuaiYksJyhbwohVVFnqecS35MLnZnl75ddRiiXrhgsa5Ng20XNGQK0kIUkPVWvrNa34bgsdJL7xbGrzUwvWGm53rLTG-YaSZ1z6zfOv8NMMGauvKmsS78raZ8g23ru9r5sH_2zaHXwTpsLJbOo426bN2_OT86MYNJ</recordid><startdate>20100701</startdate><enddate>20100701</enddate><creator>Chai, Xiao</creator><creator>Zou, Guisheng</creator><creator>Guo, Wei</creator><creator>Wu, Aiping</creator><creator>He, Jiarun</creator><creator>Bai, Hailin</creator><creator>Xiao, Ling</creator><creator>Jiao, Yulei</creator><creator>Jialie, Ren</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7U5</scope><scope>8FD</scope><scope>H8G</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20100701</creationdate><title>Fast joining of melt textured Y–Ba–Cu–O bulks with high quality</title><author>Chai, Xiao ; Zou, Guisheng ; Guo, Wei ; Wu, Aiping ; He, Jiarun ; Bai, Hailin ; Xiao, Ling ; Jiao, Yulei ; Jialie, Ren</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c366t-57dc8751178d850407411c15e44e9475f9e1a4584f0754c37e39d4c798823353</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2010</creationdate><topic>Ag-doped Y–Ba–Cu–O solder</topic><topic>BONDING</topic><topic>Condensed matter: electronic structure, electrical, magnetic, and optical properties</topic><topic>Crystals</topic><topic>Exact sciences and technology</topic><topic>Granular, melt-textured, amorphous and composite superconductors</topic><topic>Inhomogeneous superconductors and superconducting systems</topic><topic>JOINING</topic><topic>Melts</topic><topic>Microstructure</topic><topic>MICROSTRUCTURES</topic><topic>Physics</topic><topic>Silver</topic><topic>SUPERCONDUCTIVITY</topic><topic>Yttrium</topic><topic>YTTRIUM OXIDE</topic><topic>Y–Ba–Cu–O superconducting bulks</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chai, Xiao</creatorcontrib><creatorcontrib>Zou, Guisheng</creatorcontrib><creatorcontrib>Guo, Wei</creatorcontrib><creatorcontrib>Wu, Aiping</creatorcontrib><creatorcontrib>He, Jiarun</creatorcontrib><creatorcontrib>Bai, Hailin</creatorcontrib><creatorcontrib>Xiao, Ling</creatorcontrib><creatorcontrib>Jiao, Yulei</creatorcontrib><creatorcontrib>Jialie, Ren</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Physica. C, Superconductivity</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Chai, Xiao</au><au>Zou, Guisheng</au><au>Guo, Wei</au><au>Wu, Aiping</au><au>He, Jiarun</au><au>Bai, Hailin</au><au>Xiao, Ling</au><au>Jiao, Yulei</au><au>Jialie, Ren</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Fast joining of melt textured Y–Ba–Cu–O bulks with high quality</atitle><jtitle>Physica. C, Superconductivity</jtitle><date>2010-07-01</date><risdate>2010</risdate><volume>470</volume><issue>13</issue><spage>598</spage><epage>601</epage><pages>598-601</pages><issn>0921-4534</issn><eissn>1873-2143</eissn><abstract>Y–Ba–Cu–O bulk superconductors were fast joined using Ag-doped Y–Ba–Cu–O solder (metallic Ag powder additive). The joining process was relatively shorter (around 24
h) comparing with the traditional joining method. The microstructures and the superconducting properties of the joints were evaluated carefully. Microstructure analysis revealed that the crystal pattern in the joint was almost the same as that of the base material. This indicated that the bonding zone grew along the growth direction of the base material. The trapped-field distribution of the joined bulk was almost uniform and only single peak was found. This demonstrated that strong bonding was achieved in the joining process. The ratio of joined bulk’s levitation force to that of original base material was up to 93.5%.</abstract><cop>Amsterdam</cop><pub>Elsevier B.V</pub><doi>10.1016/j.physc.2010.05.236</doi><tpages>4</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0921-4534 |
| ispartof | Physica. C, Superconductivity, 2010-07, Vol.470 (13), p.598-601 |
| issn | 0921-4534 1873-2143 |
| language | eng |
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| source | ScienceDirect Journals |
| subjects | Ag-doped Y–Ba–Cu–O solder BONDING Condensed matter: electronic structure, electrical, magnetic, and optical properties Crystals Exact sciences and technology Granular, melt-textured, amorphous and composite superconductors Inhomogeneous superconductors and superconducting systems JOINING Melts Microstructure MICROSTRUCTURES Physics Silver SUPERCONDUCTIVITY Yttrium YTTRIUM OXIDE Y–Ba–Cu–O superconducting bulks |
| title | Fast joining of melt textured Y–Ba–Cu–O bulks with high quality |
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