Microstructure evolution during dewetting in thin Au films

Thin metal films can degrade into particles in a process known as dewetting. Dewetting proceeds in several stages, including void initiation, void growth and void coalescence. Branched void growth in thin Au films was studied by means of electron backscatter diffraction (EBSD). The holes were found...

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Bibliographic Details
Published in:Acta materialia 2010-10, Vol.58 (18), p.6035-6045
Main Authors: Müller, Claudia Manuela, Spolenak, Ralph
Format: Article
Language:English
Subjects:
Annealing
Applied sciences
Branched
Cross-disciplinary physics: materials science
rheology
Dewetting
Electron back scatter diffraction
Electron backscatter diffraction
Exact sciences and technology
Gold
Materials science
Metals. Metallurgy
Methods of deposition of films and coatings
film growth and epitaxy
Physics
Surface energy
Surface layer
Texture
Thin films
Voids
Wetting
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Summary:Thin metal films can degrade into particles in a process known as dewetting. Dewetting proceeds in several stages, including void initiation, void growth and void coalescence. Branched void growth in thin Au films was studied by means of electron backscatter diffraction (EBSD). The holes were found to protrude into the film predominantly at high angle grain boundaries and the branched shape of the holes can be explained by surface energy minimization of the grains at the void boundaries. (1 1 1) Texture sharpening during dewetting was observed and quantified by EBSD and in situ X-ray studies.
ISSN:1359-6454
1873-2453
DOI:10.1016/j.actamat.2010.07.021