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Laser sintering of Cu paste film printed on polyimide substrate
► Highly conductive Cu films are printed on polyimide substrate by sintering Cu paste with laser. ► Sintered films are mechanically robust and very compact microstructure is observed throughout the whole thickness. ► Laser-sintered film shows an electrical resistivity comparable to that of thermally...
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| Published in: | Applied surface science 2011-10, Vol.258 (1), p.521-524 |
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| Main Authors: | , , , |
| Format: | Article |
| Language: | English |
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| cited_by | cdi_FETCH-LOGICAL-c435t-d9ccabea8a41244eb8faba53a51d6b73f22f8b982b5ab4916f8b302e6d0b1b7b3 |
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| cites | cdi_FETCH-LOGICAL-c435t-d9ccabea8a41244eb8faba53a51d6b73f22f8b982b5ab4916f8b302e6d0b1b7b3 |
| container_end_page | 524 |
| container_issue | 1 |
| container_start_page | 521 |
| container_title | Applied surface science |
| container_volume | 258 |
| creator | Joo, Myungo Lee, Byoungyoon Jeong, Sooncheol Lee, Myeongkyu |
| description | ► Highly conductive Cu films are printed on polyimide substrate by sintering Cu paste with laser. ► Sintered films are mechanically robust and very compact microstructure is observed throughout the whole thickness. ► Laser-sintered film shows an electrical resistivity comparable to that of thermally sintered film.
We here show that highly conductive copper films are obtainable from Cu paste by laser sintering. The Cu paste synthesized using an organo-metallic compound was screen-printed onto polyimide substrate and the printed films were scanned by an ultraviolet laser beam at 355
nm under nitrogen atmosphere. Very compact microstructure was observed throughout the whole thickness and the sintered films were mechanically robust. Although Cu is known susceptible to oxidation, no Cu oxides were incorporated into the film during laser sintering. An electrical resistivity of 1.86
×
10
−5
Ω
cm was obtained. This resistivity is several orders of magnitude lower than those reported for the copper nanoparticle paste thermally sintered under N
2 or H
2 atmosphere. |
| doi_str_mv | 10.1016/j.apsusc.2011.08.076 |
| format | article |
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We here show that highly conductive copper films are obtainable from Cu paste by laser sintering. The Cu paste synthesized using an organo-metallic compound was screen-printed onto polyimide substrate and the printed films were scanned by an ultraviolet laser beam at 355
nm under nitrogen atmosphere. Very compact microstructure was observed throughout the whole thickness and the sintered films were mechanically robust. Although Cu is known susceptible to oxidation, no Cu oxides were incorporated into the film during laser sintering. An electrical resistivity of 1.86
×
10
−5
Ω
cm was obtained. This resistivity is several orders of magnitude lower than those reported for the copper nanoparticle paste thermally sintered under N
2 or H
2 atmosphere.</description><identifier>ISSN: 0169-4332</identifier><identifier>EISSN: 1873-5584</identifier><identifier>DOI: 10.1016/j.apsusc.2011.08.076</identifier><language>eng</language><publisher>Amsterdam: Elsevier B.V</publisher><subject>ATMOSPHERES ; Condensed matter: electronic structure, electrical, magnetic, and optical properties ; Condensed matter: structure, mechanical and thermal properties ; Copper ; Cross-disciplinary physics: materials science; rheology ; Cu paste ; ELECTRICAL CONDUCTIVITY ; Electrical resistivity ; Exact sciences and technology ; Flexible substrate ; Laser sintering ; LASERS ; MICROSTRUCTURES ; Nanostructure ; Pastes ; Physics ; Polyimide resins ; POLYIMIDES ; RESINS ; SINTERING</subject><ispartof>Applied surface science, 2011-10, Vol.258 (1), p.521-524</ispartof><rights>2011 Elsevier B.V.</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c435t-d9ccabea8a41244eb8faba53a51d6b73f22f8b982b5ab4916f8b302e6d0b1b7b3</citedby><cites>FETCH-LOGICAL-c435t-d9ccabea8a41244eb8faba53a51d6b73f22f8b982b5ab4916f8b302e6d0b1b7b3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=24708553$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Joo, Myungo</creatorcontrib><creatorcontrib>Lee, Byoungyoon</creatorcontrib><creatorcontrib>Jeong, Sooncheol</creatorcontrib><creatorcontrib>Lee, Myeongkyu</creatorcontrib><title>Laser sintering of Cu paste film printed on polyimide substrate</title><title>Applied surface science</title><description>► Highly conductive Cu films are printed on polyimide substrate by sintering Cu paste with laser. ► Sintered films are mechanically robust and very compact microstructure is observed throughout the whole thickness. ► Laser-sintered film shows an electrical resistivity comparable to that of thermally sintered film.
We here show that highly conductive copper films are obtainable from Cu paste by laser sintering. The Cu paste synthesized using an organo-metallic compound was screen-printed onto polyimide substrate and the printed films were scanned by an ultraviolet laser beam at 355
nm under nitrogen atmosphere. Very compact microstructure was observed throughout the whole thickness and the sintered films were mechanically robust. Although Cu is known susceptible to oxidation, no Cu oxides were incorporated into the film during laser sintering. An electrical resistivity of 1.86
×
10
−5
Ω
cm was obtained. This resistivity is several orders of magnitude lower than those reported for the copper nanoparticle paste thermally sintered under N
2 or H
2 atmosphere.</description><subject>ATMOSPHERES</subject><subject>Condensed matter: electronic structure, electrical, magnetic, and optical properties</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Copper</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Cu paste</subject><subject>ELECTRICAL CONDUCTIVITY</subject><subject>Electrical resistivity</subject><subject>Exact sciences and technology</subject><subject>Flexible substrate</subject><subject>Laser sintering</subject><subject>LASERS</subject><subject>MICROSTRUCTURES</subject><subject>Nanostructure</subject><subject>Pastes</subject><subject>Physics</subject><subject>Polyimide resins</subject><subject>POLYIMIDES</subject><subject>RESINS</subject><subject>SINTERING</subject><issn>0169-4332</issn><issn>1873-5584</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2011</creationdate><recordtype>article</recordtype><recordid>eNp9kM1r3DAQxUVIIdu0_0EOuhRysaNPW3tJCEs_Agu9tGcxksdBi9d2NXYg_320bOgxp2F4vzfDe4zdSFFLIZu7Qw0zrRRrJaSshatF21ywjXStrqx15pJtCratjNbqin0mOgghVVE37GEPhJlTGhfMaXzmU893K5-BFuR9Go58ziet49PI52l4TcfUIac10JJhwS_sUw8D4df3ec3-_vj-Z_er2v_--bR73FfRaLtU3TZGCAgOjFTGYHA9BLAarOya0Opeqd6FrVPBQjBb2ZRNC4VNJ4IMbdDX7PZ8d87TvxVp8cdEEYcBRpxW8rJppda25CqoOaMxT0QZe18iHCG_ein8qS9_8Oe-_KkvL5wvfRXbt_cPQBGGPsMYE_33KtMKZ60u3P2ZwxL3JWH2FBOOEbuUMS6-m9LHj94A206DVg</recordid><startdate>20111015</startdate><enddate>20111015</enddate><creator>Joo, Myungo</creator><creator>Lee, Byoungyoon</creator><creator>Jeong, Sooncheol</creator><creator>Lee, Myeongkyu</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>H8D</scope><scope>H8G</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20111015</creationdate><title>Laser sintering of Cu paste film printed on polyimide substrate</title><author>Joo, Myungo ; Lee, Byoungyoon ; Jeong, Sooncheol ; Lee, Myeongkyu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c435t-d9ccabea8a41244eb8faba53a51d6b73f22f8b982b5ab4916f8b302e6d0b1b7b3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2011</creationdate><topic>ATMOSPHERES</topic><topic>Condensed matter: electronic structure, electrical, magnetic, and optical properties</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Copper</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Cu paste</topic><topic>ELECTRICAL CONDUCTIVITY</topic><topic>Electrical resistivity</topic><topic>Exact sciences and technology</topic><topic>Flexible substrate</topic><topic>Laser sintering</topic><topic>LASERS</topic><topic>MICROSTRUCTURES</topic><topic>Nanostructure</topic><topic>Pastes</topic><topic>Physics</topic><topic>Polyimide resins</topic><topic>POLYIMIDES</topic><topic>RESINS</topic><topic>SINTERING</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Joo, Myungo</creatorcontrib><creatorcontrib>Lee, Byoungyoon</creatorcontrib><creatorcontrib>Jeong, Sooncheol</creatorcontrib><creatorcontrib>Lee, Myeongkyu</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Applied surface science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Joo, Myungo</au><au>Lee, Byoungyoon</au><au>Jeong, Sooncheol</au><au>Lee, Myeongkyu</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Laser sintering of Cu paste film printed on polyimide substrate</atitle><jtitle>Applied surface science</jtitle><date>2011-10-15</date><risdate>2011</risdate><volume>258</volume><issue>1</issue><spage>521</spage><epage>524</epage><pages>521-524</pages><issn>0169-4332</issn><eissn>1873-5584</eissn><abstract>► Highly conductive Cu films are printed on polyimide substrate by sintering Cu paste with laser. ► Sintered films are mechanically robust and very compact microstructure is observed throughout the whole thickness. ► Laser-sintered film shows an electrical resistivity comparable to that of thermally sintered film.
We here show that highly conductive copper films are obtainable from Cu paste by laser sintering. The Cu paste synthesized using an organo-metallic compound was screen-printed onto polyimide substrate and the printed films were scanned by an ultraviolet laser beam at 355
nm under nitrogen atmosphere. Very compact microstructure was observed throughout the whole thickness and the sintered films were mechanically robust. Although Cu is known susceptible to oxidation, no Cu oxides were incorporated into the film during laser sintering. An electrical resistivity of 1.86
×
10
−5
Ω
cm was obtained. This resistivity is several orders of magnitude lower than those reported for the copper nanoparticle paste thermally sintered under N
2 or H
2 atmosphere.</abstract><cop>Amsterdam</cop><pub>Elsevier B.V</pub><doi>10.1016/j.apsusc.2011.08.076</doi><tpages>4</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0169-4332 |
| ispartof | Applied surface science, 2011-10, Vol.258 (1), p.521-524 |
| issn | 0169-4332 1873-5584 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_1671335001 |
| source | ScienceDirect Freedom Collection |
| subjects | ATMOSPHERES Condensed matter: electronic structure, electrical, magnetic, and optical properties Condensed matter: structure, mechanical and thermal properties Copper Cross-disciplinary physics: materials science rheology Cu paste ELECTRICAL CONDUCTIVITY Electrical resistivity Exact sciences and technology Flexible substrate Laser sintering LASERS MICROSTRUCTURES Nanostructure Pastes Physics Polyimide resins POLYIMIDES RESINS SINTERING |
| title | Laser sintering of Cu paste film printed on polyimide substrate |
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