Study of the actuation speed, bounces occurrences, and contact reliability of ohmic RF-MEMS switches

The influence of the bias signal waveform on the electromechanical dynamic response of ohmic RF-MEMS switches is here investigated by means of electromechanical characterizations and modelling procedures. The actuation transient of ohmic RF-MEMS switches was studied in this work developing a fast to...

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Bibliographic Details
Published in:Microelectronics and reliability 2010-09, Vol.50 (9), p.1604-1608
Main Authors: Tazzoli, A., Barbato, M., Mattiuzzo, F., Ritrovato, V., Meneghesso, G.
Format: Article
Language:English
Subjects:
Actuation
Applied sciences
Bias
Circuit properties
Dynamic response
Dynamic tests
Electric, optical and optoelectronic circuits
Electronic circuits
Electronics
Exact sciences and technology
Mathematical models
Micro- and nanoelectromechanical devices (mems/nems)
Ohmic
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Switches
Switching, multiplexing, switched capacity circuits
Waveforms
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Summary:The influence of the bias signal waveform on the electromechanical dynamic response of ohmic RF-MEMS switches is here investigated by means of electromechanical characterizations and modelling procedures. The actuation transient of ohmic RF-MEMS switches was studied in this work developing a fast to compute, but comprehensive electromechanical model, using electromechanical parameters from experimental results. The developed model was then used to investigate how different bias waveforms influence the switch dynamic, in terms of actuation time, and bounces occurrences, and a practical solution to limit bounces, without compromising the actuation time was presented. Furthermore, it was demonstrated how it is possible to improve the reliability to cycling stress using ad hoc shaped bias signals.
ISSN:0026-2714
1872-941X
DOI:10.1016/j.microrel.2010.07.034