Microwave circuits in multilayer inorganic-organic polymer thin film technology on laminate substrates

Requirements of higher performance, reduced size, weight and cost of high-frequency (HF) devices has led to the search for new: materials, material combinations, methods, processes and production equipment. Efficient technologies for producing HF-circuits and integral passives are looked for. Also o...

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Bibliographic Details
Published in:IEEE transactions on advanced packaging 2003-02, Vol.26 (1), p.81-89
Main Authors: Johansson, C., Uhlig, S., Tageman, O., Alping, A., Haglund, J., Robertsson, M., Popall, M., Frohlich, L.
Format: Article
Language:English
Subjects:
Accumulation
Applied sciences
Circuit properties
Costs
Devices
Dielectrics
Electric, optical and optoelectronic circuits
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Hafnium
High frequency electrical characterization
Integrated circuit technology
Laminates
Microelectronic fabrication (materials and surfaces technology)
Microwave circuits
Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits
Microwave devices
Microwave technology
multilayer thin film technology
Multilayers
Nonhomogeneous media
ORMOCER
Packaging
Packaging machines
Polymer films
Searching
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Substrates
TECHNOLOGY
TEKNIKVETENSKAP
Thin films
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Summary:Requirements of higher performance, reduced size, weight and cost of high-frequency (HF) devices has led to the search for new: materials, material combinations, methods, processes and production equipment. Efficient technologies for producing HF-circuits and integral passives are looked for. Also of interest are integrated packaging solutions for high frequency electrical packaging and optical interconnects and packaging. Sequentially build up multi-layers have been deposited on a low cost FR-4 epoxy substrate. The dielectric layers consist of a photo-patternable inorganic-organic hybrid polymer (ORMOCER) and the metallization is Cu. An UV-exposure equipment enabling projection patterning with 5 /spl mu/m resolution have been used. The produced microstrip lines, ring resonators, vias, stacked capacitors and filters have been characterized at frequencies from 1 to 40 GHz showing the potential of the new dielectric materials and processing technologies for microwave applications.
ISSN:1521-3323
1557-9980
1557-9980
DOI:10.1109/TADVP.2003.811548