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The impact of TiN capping Layer on NiSi, CoSi sub(2), and Co sub(x)Ni sub(1-x)Si sub( 2) FUSI metal gate work function adjustment

The impact of TiN capping layer on dual work functions of Ni, Co, and Co-Ni fully silicided (FUSI) metal gates was investigated. It was found that the TiN capping layer significantly altered the distribution of both n- and p-dopants during the FUSI process, which in turn changed the work functions o...

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Published in:IEEE transactions on electron devices 2005-01, Vol.52 (12)
Main Authors: Liu, Jun, Wen, Huang-Chun, Lu, Jiong-Ping, Kwong, Dim-Lee
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Language:English
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Lu, Jiong-Ping
Kwong, Dim-Lee
description The impact of TiN capping layer on dual work functions of Ni, Co, and Co-Ni fully silicided (FUSI) metal gates was investigated. It was found that the TiN capping layer significantly altered the distribution of both n- and p-dopants during the FUSI process, which in turn changed the work functions of both As-doped and B-doped in the three FUSI metal gate systems. The work function tuning was found to have a linear relationship with the change of dopant level at the silicides/dielectric interface after adding TiN capping layer. The investigation of TiN capping layer on FUSI provided some insights on work function tuning mechanism in FUSI systems. This work also suggested a new methodology for optimizing the nMOS and pMOS work functions for CMOS device applications.
doi_str_mv 10.1109/TED.2005.859700
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fullrecord <record><control><sourceid>proquest</sourceid><recordid>TN_cdi_proquest_miscellaneous_1671401187</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>1671401187</sourcerecordid><originalsourceid>FETCH-proquest_miscellaneous_16714011873</originalsourceid><addsrcrecordid>eNqVjMFugkAURWdhk9radbdvKYnge4ACa6uxScMGujZTHHQUZigzk9pl_1zS-gNd3ZyTk8vYM2FAhNm8XL8EIeIiSBdZgjhiY0RK_SxKo3v2YMxpwGUch2P2Ux4FyLbjlQVdQylzqHjXSXWAN_4tetAKclnIGax0IcG4j2nozYCr_SB-8eLlf578i3dLIPRg8168Qissb-DArYAv3Z-hdqqycvjk-5MzthXKTthdzRsjnm77yKabdbna-l2vP50wdtdKU4mm4UpoZ3a0TChGojSJ_pFeAQnGVIc</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1671401187</pqid></control><display><type>article</type><title>The impact of TiN capping Layer on NiSi, CoSi sub(2), and Co sub(x)Ni sub(1-x)Si sub( 2) FUSI metal gate work function adjustment</title><source>IEEE Electronic Library (IEL) Journals</source><creator>Liu, Jun ; Wen, Huang-Chun ; Lu, Jiong-Ping ; Kwong, Dim-Lee</creator><creatorcontrib>Liu, Jun ; Wen, Huang-Chun ; Lu, Jiong-Ping ; Kwong, Dim-Lee</creatorcontrib><description>The impact of TiN capping layer on dual work functions of Ni, Co, and Co-Ni fully silicided (FUSI) metal gates was investigated. It was found that the TiN capping layer significantly altered the distribution of both n- and p-dopants during the FUSI process, which in turn changed the work functions of both As-doped and B-doped in the three FUSI metal gate systems. The work function tuning was found to have a linear relationship with the change of dopant level at the silicides/dielectric interface after adding TiN capping layer. The investigation of TiN capping layer on FUSI provided some insights on work function tuning mechanism in FUSI systems. This work also suggested a new methodology for optimizing the nMOS and pMOS work functions for CMOS device applications.</description><identifier>ISSN: 0018-9383</identifier><identifier>DOI: 10.1109/TED.2005.859700</identifier><language>eng</language><subject>Capping ; CMOS ; Devices ; Gates ; Silicides ; Tin ; Tuning ; Work functions</subject><ispartof>IEEE transactions on electron devices, 2005-01, Vol.52 (12)</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail></links><search><creatorcontrib>Liu, Jun</creatorcontrib><creatorcontrib>Wen, Huang-Chun</creatorcontrib><creatorcontrib>Lu, Jiong-Ping</creatorcontrib><creatorcontrib>Kwong, Dim-Lee</creatorcontrib><title>The impact of TiN capping Layer on NiSi, CoSi sub(2), and Co sub(x)Ni sub(1-x)Si sub( 2) FUSI metal gate work function adjustment</title><title>IEEE transactions on electron devices</title><description>The impact of TiN capping layer on dual work functions of Ni, Co, and Co-Ni fully silicided (FUSI) metal gates was investigated. It was found that the TiN capping layer significantly altered the distribution of both n- and p-dopants during the FUSI process, which in turn changed the work functions of both As-doped and B-doped in the three FUSI metal gate systems. The work function tuning was found to have a linear relationship with the change of dopant level at the silicides/dielectric interface after adding TiN capping layer. The investigation of TiN capping layer on FUSI provided some insights on work function tuning mechanism in FUSI systems. This work also suggested a new methodology for optimizing the nMOS and pMOS work functions for CMOS device applications.</description><subject>Capping</subject><subject>CMOS</subject><subject>Devices</subject><subject>Gates</subject><subject>Silicides</subject><subject>Tin</subject><subject>Tuning</subject><subject>Work functions</subject><issn>0018-9383</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2005</creationdate><recordtype>article</recordtype><recordid>eNqVjMFugkAURWdhk9radbdvKYnge4ACa6uxScMGujZTHHQUZigzk9pl_1zS-gNd3ZyTk8vYM2FAhNm8XL8EIeIiSBdZgjhiY0RK_SxKo3v2YMxpwGUch2P2Ux4FyLbjlQVdQylzqHjXSXWAN_4tetAKclnIGax0IcG4j2nozYCr_SB-8eLlf578i3dLIPRg8168Qissb-DArYAv3Z-hdqqycvjk-5MzthXKTthdzRsjnm77yKabdbna-l2vP50wdtdKU4mm4UpoZ3a0TChGojSJ_pFeAQnGVIc</recordid><startdate>20050101</startdate><enddate>20050101</enddate><creator>Liu, Jun</creator><creator>Wen, Huang-Chun</creator><creator>Lu, Jiong-Ping</creator><creator>Kwong, Dim-Lee</creator><scope>7SP</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>L7M</scope></search><sort><creationdate>20050101</creationdate><title>The impact of TiN capping Layer on NiSi, CoSi sub(2), and Co sub(x)Ni sub(1-x)Si sub( 2) FUSI metal gate work function adjustment</title><author>Liu, Jun ; Wen, Huang-Chun ; Lu, Jiong-Ping ; Kwong, Dim-Lee</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-proquest_miscellaneous_16714011873</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2005</creationdate><topic>Capping</topic><topic>CMOS</topic><topic>Devices</topic><topic>Gates</topic><topic>Silicides</topic><topic>Tin</topic><topic>Tuning</topic><topic>Work functions</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Liu, Jun</creatorcontrib><creatorcontrib>Wen, Huang-Chun</creatorcontrib><creatorcontrib>Lu, Jiong-Ping</creatorcontrib><creatorcontrib>Kwong, Dim-Lee</creatorcontrib><collection>Electronics &amp; Communications Abstracts</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology &amp; Engineering</collection><collection>Engineering Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE transactions on electron devices</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Liu, Jun</au><au>Wen, Huang-Chun</au><au>Lu, Jiong-Ping</au><au>Kwong, Dim-Lee</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The impact of TiN capping Layer on NiSi, CoSi sub(2), and Co sub(x)Ni sub(1-x)Si sub( 2) FUSI metal gate work function adjustment</atitle><jtitle>IEEE transactions on electron devices</jtitle><date>2005-01-01</date><risdate>2005</risdate><volume>52</volume><issue>12</issue><issn>0018-9383</issn><abstract>The impact of TiN capping layer on dual work functions of Ni, Co, and Co-Ni fully silicided (FUSI) metal gates was investigated. It was found that the TiN capping layer significantly altered the distribution of both n- and p-dopants during the FUSI process, which in turn changed the work functions of both As-doped and B-doped in the three FUSI metal gate systems. The work function tuning was found to have a linear relationship with the change of dopant level at the silicides/dielectric interface after adding TiN capping layer. The investigation of TiN capping layer on FUSI provided some insights on work function tuning mechanism in FUSI systems. This work also suggested a new methodology for optimizing the nMOS and pMOS work functions for CMOS device applications.</abstract><doi>10.1109/TED.2005.859700</doi></addata></record>
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subjects Capping
CMOS
Devices
Gates
Silicides
Tin
Tuning
Work functions
title The impact of TiN capping Layer on NiSi, CoSi sub(2), and Co sub(x)Ni sub(1-x)Si sub( 2) FUSI metal gate work function adjustment
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-03-06T09%3A52%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=The%20impact%20of%20TiN%20capping%20Layer%20on%20NiSi,%20CoSi%20sub(2),%20and%20Co%20sub(x)Ni%20sub(1-x)Si%20sub(%202)%20FUSI%20metal%20gate%20work%20function%20adjustment&rft.jtitle=IEEE%20transactions%20on%20electron%20devices&rft.au=Liu,%20Jun&rft.date=2005-01-01&rft.volume=52&rft.issue=12&rft.issn=0018-9383&rft_id=info:doi/10.1109/TED.2005.859700&rft_dat=%3Cproquest%3E1671401187%3C/proquest%3E%3Cgrp_id%3Ecdi_FETCH-proquest_miscellaneous_16714011873%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=1671401187&rft_id=info:pmid/&rfr_iscdi=true