Photonic integrated technology for multi-wavelength laser emission

• Published in: Chinese science bulletin 2011-10, Vol.56 (28-29), p.3064-3071
• Main Authors: Chen, XiangFei, Liu, Wen, An, JunMing, Liu, Yu, Xu, Kun, Wang, Xin, Liu, JianGuo, Ji, YueFeng, Zhu, NingHua
• Format: Article
• Language: English
• Subjects: Arrays; Chemistry/Food Science; Compensation; Dynamic characteristics; Earth Sciences; electronic equipment; Engineering; equipment design; Humanities and Social Sciences; Lasers; Life Sciences; multidisciplinary; Nanostructure; nanotechnology; Packaging; Photonics; Physics; Review; Science; Science (multidisciplinary); Waveguides; 光子集成; 制造技术; 单片集成; 多波长激光; 激光传输; 激光发射; 阵列波导; 集成技术
• ISSN: 1001-6538; 1861-9541
• DOI: 10.1007/s11434-011-4677-7

We summarized the design, fabrication challenges and important technologies for multi-wavelength laser transmitting photonic integration. Technologies discussed include multi-wavelength laser arrays, monolithic integration and modularizing coupling and packaging. Fabrication technique requirements have significantly declined with the rise of reconstruction-equivalent-chirp and second nanoimprint mask technologies. The monolithic integration problem between active and passive waveguides can be overcome with Butt-joint and InP array waveguide grating technologies. The dynamic characteristics of multi-factors will be simultaneously measured with multi-port analyzing modules. The performance of photonic integration chips is significantly improved with the autoecious factors compensation packaging technique.