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Deposition of fluorine doped indium oxide by atmospheric pressure chemical vapour deposition

We report the deposition of fluorine doped indium oxide by atmospheric pressure chemical vapour deposition (APCVD) using a previously unreported precursor combination; dimethylindium acetylacetonate, [Me 2In(acac)] and trifluoroacetic acid (TFA). This process is potentially scalable for high through...

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Bibliographic Details
Published in:Thin solid films 2011-12, Vol.520 (4), p.1242-1245
Main Authors: Sheel, David W., Gaskell, Jeffrey M.
Format: Article
Language:English
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Summary:We report the deposition of fluorine doped indium oxide by atmospheric pressure chemical vapour deposition (APCVD) using a previously unreported precursor combination; dimethylindium acetylacetonate, [Me 2In(acac)] and trifluoroacetic acid (TFA). This process is potentially scalable for high throughput, large area production. [Me 2In(acac)] is a volatile solid. It is more stable and easier to handle than traditional indium oxide precursors such as pyrophoric trialkylindium compounds. Cubic fluorine doped indium oxide (F.In 2O 3) was deposited at a substrate temperature of 550 °C with growth rates exceeding 8 nm/s. Resistivity was 8 × 10 − 4 Ω cm and transmission for a 200 nm film was > 80% with less than 1% haze.
ISSN:0040-6090
1879-2731
DOI:10.1016/j.tsf.2011.04.206