Microstructure Evolution of Ni Fe -Cu Deposited by Electroplating Under an Applied Field

• Published in: IEEE transactions on magnetics 2007-06, Vol.43 (6), p.2980-2982
• Main Authors: Yi, J.B., Li, X.P., Ding, J., Yin, J.H., Thongmee, S., Seet, H.L.
• Format: Article
• Language: English
• Subjects: Applied field; Atomic force microscopy; Atomic layer deposition; Atomic measurements; Coercive force; composite wire; COPPER ALLOYS (10 TO 40 CU); DEPOSITION; ELECTRODEPOSITION; ELECTROPLATING; Evolution; Grain size; Iron; Magnetic field measurement; Magnetism; MAGNETOHYDRODYNAMICS; magnetoimpedence (MI); Microstructure; MICROSTRUCTURES; Scanning electron microscopy; Surface morphology; WIRE
• ISSN: 0018-9464; 1941-0069
• DOI: 10.1109/TMAG.2007.893416

A study of the microstructure evolution of Ni 80 Fe 20 -Cu composite wires made by electrodeposition under an applied magnetic field is presented. Ni 80 Fe 20 -Cu composite wire samples were deposited by electroplating under an applied field parallel to the wire axis and varying from 0 to 400 Oe. Magnetoimpedence (MI) measurement showed that the magnitude of MI first scaled with the increasing of the applied field until the field was larger than 200 Oe. Further increasing the applied field led to the reduction of MI effect. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) indicated that the surface deposited under the applied field of 200 Oe was the best in terms of smoothness and uniformity, indicating that the applied field affected the growth of the deposited layers. The composite wire under 200 Oe applied field possessed a low coercivity (0.35 Oe) and small grain size, which may be attributed to the high MI effect. The surface morphology change is due to the magnetohydrodynamic (MHD) effect