Inverse temperature dependence of activation volume in ultrafine-grained copper processed by accumulative roll-bonding

Tensile tests and strain-rate jump tests were carried out at several temperatures below room temperature on Cu processed by accumulative roll-bonding (ARB). The temperature dependences of the flow stress and the activation volume were determined. In contrast to conventional coarse-grained materials...

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Bibliographic Details
Published in:Journal of materials science 2011-06, Vol.46 (12), p.4302-4307
Main Authors: Kunimine, Takahiro, Aragaki, Takashi, Fujii, Toshiyuki, Onaka, Susumu, Kato, Masaharu
Format: Article
Language:English
Subjects:
Activation
Alloys
BONDING
Characterization and Evaluation of Materials
Chemistry and Materials Science
Classical Mechanics
Copper
Crystallography and Scattering Methods
Dependence
Dislocations
FLOW STRESS
Grain boundaries
Grain industry
GRAIN SIZE AND SHAPE
Iib 2010
Inverse
Materials Science
Polymer Sciences
Roll bonding
Solid Mechanics
Strain rate
Temperature
Temperature dependence
Tensile tests
Ultrafines
YIELD STRENGTH
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Summary:Tensile tests and strain-rate jump tests were carried out at several temperatures below room temperature on Cu processed by accumulative roll-bonding (ARB). The temperature dependences of the flow stress and the activation volume were determined. In contrast to conventional coarse-grained materials where the activation volume increases with increasing temperature, the ARB processed copper by 8 cycles with ultrafine-grains showed inverse temperature dependence of activation volume, i.e., decreased activation volume with increasing temperature. This inverse temperature dependence of the activation volume is discussed in terms of thermally activated dislocation bow-out from grain-boundaries.
ISSN:0022-2461
1573-4803
DOI:10.1007/s10853-010-5243-4