Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications

[Display omitted] This paper reports the investigations into the moisture induced failures in Flip-Chip-on-Flex interconnections using Anisotropic Conductive Films (ACFs). Both experimental and modelling methods were applied. In the experiments, the joint resistance was used as a quality indicator a...

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Bibliographic Details
Published in:Microelectronic engineering 2013-07, Vol.107, p.17-22
Main Authors: Yin, C.Y., Lu, H., Bailey, C., Chan, Y.C.
Format: Article
Language:English
Subjects:
Adhesives
Anisotropic conductive film (ACF)
Anisotropy
Applied sciences
Assembly
Autoclaves
Chips
Condensed matter: structure, mechanical and thermal properties
Design. Technologies. Operation analysis. Testing
Diffusion in nanoscale solids
Diffusion in solids
Electrical engineering. Electrical power engineering
Electronics
Exact sciences and technology
Flip chip on flex
Integrated circuits
Materials
Modelling
Moisture
Moisture absorption
Physics
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Testing, measurement, noise and reliability
Transport properties of condensed matter (nonelectronic)
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Summary:[Display omitted] This paper reports the investigations into the moisture induced failures in Flip-Chip-on-Flex interconnections using Anisotropic Conductive Films (ACFs). Both experimental and modelling methods were applied. In the experiments, the joint resistance was used as a quality indicator and was measured continuously during the autoclave test. The test condition was set as 121°C, 100%RH and 2atm. The results showed that the joint resistance of the ACF flip chip increased during the tests and nearly 25% of the joints were found open after 168h’ testing. Visible conduction gaps between the adhesive and substrate pads were observed. Cracks at the adhesive/flex interface were also found. In order to have a better understanding of the experimental results, 3D Finite Element (FE) models of the ACF assembly were constructed and a macro–micro modelling technique was used to overcome the difficulty caused by the multi-length scale in the ACF assembly. The moisture diffusion and moisture-induced stresses in the ACF flip chip during the autoclave test were predicted. Modelling results are consistent with the findings in the experimental work.
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2013.02.070