Fabrication of Super Hydrophobic Surfaces on Copper by Solution-immersion

Super hydrophobic copper wafer was prepared by means of solution immersion and surface self-assembly methods. Different immersion conditions were explored for the best hydrophobic surface. Scanning electron microscopy （SEM）, X-ray diffraction （XRD）, energy dispersive spectrometer （EDS） and water con...

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Bibliographic Details
Published in:Chinese journal of chemical engineering 2013-08, Vol.21 (8), p.920-926
Main Author: 龚志金 王建莉 吴丽梅 王小雨 吕国诚 廖立兵
Format: Article
Language:English
Subjects:
COMPUTER SIMULATION
Contact angle
Copper
FABRICATION
Immersion
Molecular dynamics
molecular dynamics simulation
Molecular structure
Scanning electron microscopy
Self assembly
Spectrometers
super hydrophobic
储存稳定性
分子动力学模拟
制备
扫描电子显微镜
溶液浸泡
疏水表面
超疏水性表面
铜衬底
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Summary:Super hydrophobic copper wafer was prepared by means of solution immersion and surface self-assembly methods. Different immersion conditions were explored for the best hydrophobic surface. Scanning electron microscopy （SEM）, X-ray diffraction （XRD）, energy dispersive spectrometer （EDS） and water contact angle measurements were used to investigate the morphologies, microstructures, chemical compositions and hydrophobicity of the produced films on copper substrates, respectively. Results show that the super hydrophobic surface is composed of micro structure of Cu 7 S 4 . The films present a high water contact angle larger than 150°, a low sliding angle less than 3°, good abrasion resistance and storage stability. The molecular dynamics simulation confirms that N-dodecyl mercaptan molecules link up with Cu 7 S 4 admirably, compared with Cu, which contributes to the stable super hydrophobic surface.
ISSN:1004-9541
2210-321X
DOI:10.1016/S1004-9541(13)60569-8