Loading…
Anisotropic study of thermal stresses induced by diameter fluctuation during Czochralski silicon single crystal growth
Instabilities in the Czochralski crystal growth process result in deviation from the desired crystal diameter i.e. uneven crystal surface. The excessive thermoelastic stress induced by diameter perturbation is studied by mean of numerical simulations. A set of 3D simulation has been performed for an...
Saved in:
Published in: | Journal of crystal growth 2014-08, Vol.400, p.1-6 |
---|---|
Main Authors: | , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
cited_by | cdi_FETCH-LOGICAL-c408t-2769daa7d99b4d8a36f9c56c02f47f89f6a64090b63ed78e5fc68415dcd0e1eb3 |
---|---|
cites | cdi_FETCH-LOGICAL-c408t-2769daa7d99b4d8a36f9c56c02f47f89f6a64090b63ed78e5fc68415dcd0e1eb3 |
container_end_page | 6 |
container_issue | |
container_start_page | 1 |
container_title | Journal of crystal growth |
container_volume | 400 |
creator | Asadi Noghabi, Omidreza M‘Hamdi, Mohammed |
description | Instabilities in the Czochralski crystal growth process result in deviation from the desired crystal diameter i.e. uneven crystal surface. The excessive thermoelastic stress induced by diameter perturbation is studied by mean of numerical simulations. A set of 3D simulation has been performed for an axisymmetric crystal. The crystal anisotropy is taken into account. The influence of crystal diameter fluctuation on stress field inside the crystal has been studied. The resolved shear stresses have been calculated for 12 slip systems for three crystal orientations. Accumulated excess stress from its critical value is calculated. Simulation results suggest that crystal surface undulation affects both thermal field and stress distribution inside the crystal. The crystal region with high risk of dislocation generation is discussed for three crystal orientation. The stress level in [111] crystal orientation is found to be lower than other orientations.
•Effect of crystal diameter variation is studied by using an anisotropic model.•Excess stress from its critical value, τex, is calculated for set of wavelengths and amplitudes.•The stress field is found to be less sensitive for [111] crystal.•The length of non-zero τex region extends longer for [100] and [110] crystals. |
doi_str_mv | 10.1016/j.jcrysgro.2014.04.027 |
format | article |
fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_1677913167</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S0022024814003108</els_id><sourcerecordid>1567082805</sourcerecordid><originalsourceid>FETCH-LOGICAL-c408t-2769daa7d99b4d8a36f9c56c02f47f89f6a64090b63ed78e5fc68415dcd0e1eb3</originalsourceid><addsrcrecordid>eNqFkcGKFDEQhoMoOK6-guQieOnZSro7nb65DK4uLHjRc8gklZ2MPZ0xlV4Zn94Ms3pdKFJQ9VX9RX7G3gtYCxDqer_eu3yih5zWEkS3hhpyeMFWQg9t0wPIl2xVX9mA7PRr9oZoD1AnBazY480cKZWcjtFxKos_8RR42WE-2KkWMhIh8Tj7xaHn2xP30R6wYOZhWlxZbIlp5n7JcX7gmz_J7bKd6GfkFKfoaotqY0J-PrHUlfXM32X3lr0KFcN3T_mK_bj9_H3ztbn_9uVuc3PfuA50aeSgRm_t4Mdx23ltWxVG1ysHMnRD0GNQVnUwwla16AeNfXBKd6L3zgMK3LZX7ONl7zGnXwtSMYdIDqfJzpgWMkINwyjamp5HezWAlhr6iqoL6nIiyhjMMceDzScjwJw9MXvzzxNz9sRADXnW-PCkYcnZKWQ7u0j_p6XuZTd2ULlPFw7r3zxGzIZcxLk6EDO6YnyKz0n9BaMQqSM</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1567082805</pqid></control><display><type>article</type><title>Anisotropic study of thermal stresses induced by diameter fluctuation during Czochralski silicon single crystal growth</title><source>ScienceDirect Freedom Collection</source><creator>Asadi Noghabi, Omidreza ; M‘Hamdi, Mohammed</creator><creatorcontrib>Asadi Noghabi, Omidreza ; M‘Hamdi, Mohammed</creatorcontrib><description>Instabilities in the Czochralski crystal growth process result in deviation from the desired crystal diameter i.e. uneven crystal surface. The excessive thermoelastic stress induced by diameter perturbation is studied by mean of numerical simulations. A set of 3D simulation has been performed for an axisymmetric crystal. The crystal anisotropy is taken into account. The influence of crystal diameter fluctuation on stress field inside the crystal has been studied. The resolved shear stresses have been calculated for 12 slip systems for three crystal orientations. Accumulated excess stress from its critical value is calculated. Simulation results suggest that crystal surface undulation affects both thermal field and stress distribution inside the crystal. The crystal region with high risk of dislocation generation is discussed for three crystal orientation. The stress level in [111] crystal orientation is found to be lower than other orientations.
•Effect of crystal diameter variation is studied by using an anisotropic model.•Excess stress from its critical value, τex, is calculated for set of wavelengths and amplitudes.•The stress field is found to be less sensitive for [111] crystal.•The length of non-zero τex region extends longer for [100] and [110] crystals.</description><identifier>ISSN: 0022-0248</identifier><identifier>EISSN: 1873-5002</identifier><identifier>DOI: 10.1016/j.jcrysgro.2014.04.027</identifier><identifier>CODEN: JCRGAE</identifier><language>eng</language><publisher>Amsterdam: Elsevier B.V</publisher><subject>A1. Computer simulation ; A1. Stresses ; A2. Czochralski method ; A2. Single crystal growth ; Anisotropy ; B1. Semiconducting silicon ; Computer simulation ; Cross-disciplinary physics: materials science; rheology ; Crystal growth ; Crystal structure ; Crystals ; Czochralski process ; Exact sciences and technology ; Growth from melts; zone melting and refining ; Instruments for strain, force and torque ; Instruments, apparatus, components and techniques common to several branches of physics and astronomy ; Materials science ; Mathematical analysis ; Mechanical instruments, equipment and techniques ; Methods of crystal growth; physics of crystal growth ; Physics ; Stresses ; Theory and models of crystal growth; physics of crystal growth, crystal morphology and orientation</subject><ispartof>Journal of crystal growth, 2014-08, Vol.400, p.1-6</ispartof><rights>2014 Elsevier B.V.</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c408t-2769daa7d99b4d8a36f9c56c02f47f89f6a64090b63ed78e5fc68415dcd0e1eb3</citedby><cites>FETCH-LOGICAL-c408t-2769daa7d99b4d8a36f9c56c02f47f89f6a64090b63ed78e5fc68415dcd0e1eb3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,27901,27902</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=28524940$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Asadi Noghabi, Omidreza</creatorcontrib><creatorcontrib>M‘Hamdi, Mohammed</creatorcontrib><title>Anisotropic study of thermal stresses induced by diameter fluctuation during Czochralski silicon single crystal growth</title><title>Journal of crystal growth</title><description>Instabilities in the Czochralski crystal growth process result in deviation from the desired crystal diameter i.e. uneven crystal surface. The excessive thermoelastic stress induced by diameter perturbation is studied by mean of numerical simulations. A set of 3D simulation has been performed for an axisymmetric crystal. The crystal anisotropy is taken into account. The influence of crystal diameter fluctuation on stress field inside the crystal has been studied. The resolved shear stresses have been calculated for 12 slip systems for three crystal orientations. Accumulated excess stress from its critical value is calculated. Simulation results suggest that crystal surface undulation affects both thermal field and stress distribution inside the crystal. The crystal region with high risk of dislocation generation is discussed for three crystal orientation. The stress level in [111] crystal orientation is found to be lower than other orientations.
•Effect of crystal diameter variation is studied by using an anisotropic model.•Excess stress from its critical value, τex, is calculated for set of wavelengths and amplitudes.•The stress field is found to be less sensitive for [111] crystal.•The length of non-zero τex region extends longer for [100] and [110] crystals.</description><subject>A1. Computer simulation</subject><subject>A1. Stresses</subject><subject>A2. Czochralski method</subject><subject>A2. Single crystal growth</subject><subject>Anisotropy</subject><subject>B1. Semiconducting silicon</subject><subject>Computer simulation</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Crystal growth</subject><subject>Crystal structure</subject><subject>Crystals</subject><subject>Czochralski process</subject><subject>Exact sciences and technology</subject><subject>Growth from melts; zone melting and refining</subject><subject>Instruments for strain, force and torque</subject><subject>Instruments, apparatus, components and techniques common to several branches of physics and astronomy</subject><subject>Materials science</subject><subject>Mathematical analysis</subject><subject>Mechanical instruments, equipment and techniques</subject><subject>Methods of crystal growth; physics of crystal growth</subject><subject>Physics</subject><subject>Stresses</subject><subject>Theory and models of crystal growth; physics of crystal growth, crystal morphology and orientation</subject><issn>0022-0248</issn><issn>1873-5002</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2014</creationdate><recordtype>article</recordtype><recordid>eNqFkcGKFDEQhoMoOK6-guQieOnZSro7nb65DK4uLHjRc8gklZ2MPZ0xlV4Zn94Ms3pdKFJQ9VX9RX7G3gtYCxDqer_eu3yih5zWEkS3hhpyeMFWQg9t0wPIl2xVX9mA7PRr9oZoD1AnBazY480cKZWcjtFxKos_8RR42WE-2KkWMhIh8Tj7xaHn2xP30R6wYOZhWlxZbIlp5n7JcX7gmz_J7bKd6GfkFKfoaotqY0J-PrHUlfXM32X3lr0KFcN3T_mK_bj9_H3ztbn_9uVuc3PfuA50aeSgRm_t4Mdx23ltWxVG1ysHMnRD0GNQVnUwwla16AeNfXBKd6L3zgMK3LZX7ONl7zGnXwtSMYdIDqfJzpgWMkINwyjamp5HezWAlhr6iqoL6nIiyhjMMceDzScjwJw9MXvzzxNz9sRADXnW-PCkYcnZKWQ7u0j_p6XuZTd2ULlPFw7r3zxGzIZcxLk6EDO6YnyKz0n9BaMQqSM</recordid><startdate>20140815</startdate><enddate>20140815</enddate><creator>Asadi Noghabi, Omidreza</creator><creator>M‘Hamdi, Mohammed</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20140815</creationdate><title>Anisotropic study of thermal stresses induced by diameter fluctuation during Czochralski silicon single crystal growth</title><author>Asadi Noghabi, Omidreza ; M‘Hamdi, Mohammed</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c408t-2769daa7d99b4d8a36f9c56c02f47f89f6a64090b63ed78e5fc68415dcd0e1eb3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2014</creationdate><topic>A1. Computer simulation</topic><topic>A1. Stresses</topic><topic>A2. Czochralski method</topic><topic>A2. Single crystal growth</topic><topic>Anisotropy</topic><topic>B1. Semiconducting silicon</topic><topic>Computer simulation</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Crystal growth</topic><topic>Crystal structure</topic><topic>Crystals</topic><topic>Czochralski process</topic><topic>Exact sciences and technology</topic><topic>Growth from melts; zone melting and refining</topic><topic>Instruments for strain, force and torque</topic><topic>Instruments, apparatus, components and techniques common to several branches of physics and astronomy</topic><topic>Materials science</topic><topic>Mathematical analysis</topic><topic>Mechanical instruments, equipment and techniques</topic><topic>Methods of crystal growth; physics of crystal growth</topic><topic>Physics</topic><topic>Stresses</topic><topic>Theory and models of crystal growth; physics of crystal growth, crystal morphology and orientation</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Asadi Noghabi, Omidreza</creatorcontrib><creatorcontrib>M‘Hamdi, Mohammed</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Journal of crystal growth</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Asadi Noghabi, Omidreza</au><au>M‘Hamdi, Mohammed</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Anisotropic study of thermal stresses induced by diameter fluctuation during Czochralski silicon single crystal growth</atitle><jtitle>Journal of crystal growth</jtitle><date>2014-08-15</date><risdate>2014</risdate><volume>400</volume><spage>1</spage><epage>6</epage><pages>1-6</pages><issn>0022-0248</issn><eissn>1873-5002</eissn><coden>JCRGAE</coden><abstract>Instabilities in the Czochralski crystal growth process result in deviation from the desired crystal diameter i.e. uneven crystal surface. The excessive thermoelastic stress induced by diameter perturbation is studied by mean of numerical simulations. A set of 3D simulation has been performed for an axisymmetric crystal. The crystal anisotropy is taken into account. The influence of crystal diameter fluctuation on stress field inside the crystal has been studied. The resolved shear stresses have been calculated for 12 slip systems for three crystal orientations. Accumulated excess stress from its critical value is calculated. Simulation results suggest that crystal surface undulation affects both thermal field and stress distribution inside the crystal. The crystal region with high risk of dislocation generation is discussed for three crystal orientation. The stress level in [111] crystal orientation is found to be lower than other orientations.
•Effect of crystal diameter variation is studied by using an anisotropic model.•Excess stress from its critical value, τex, is calculated for set of wavelengths and amplitudes.•The stress field is found to be less sensitive for [111] crystal.•The length of non-zero τex region extends longer for [100] and [110] crystals.</abstract><cop>Amsterdam</cop><pub>Elsevier B.V</pub><doi>10.1016/j.jcrysgro.2014.04.027</doi><tpages>6</tpages></addata></record> |
fulltext | fulltext |
identifier | ISSN: 0022-0248 |
ispartof | Journal of crystal growth, 2014-08, Vol.400, p.1-6 |
issn | 0022-0248 1873-5002 |
language | eng |
recordid | cdi_proquest_miscellaneous_1677913167 |
source | ScienceDirect Freedom Collection |
subjects | A1. Computer simulation A1. Stresses A2. Czochralski method A2. Single crystal growth Anisotropy B1. Semiconducting silicon Computer simulation Cross-disciplinary physics: materials science rheology Crystal growth Crystal structure Crystals Czochralski process Exact sciences and technology Growth from melts zone melting and refining Instruments for strain, force and torque Instruments, apparatus, components and techniques common to several branches of physics and astronomy Materials science Mathematical analysis Mechanical instruments, equipment and techniques Methods of crystal growth physics of crystal growth Physics Stresses Theory and models of crystal growth physics of crystal growth, crystal morphology and orientation |
title | Anisotropic study of thermal stresses induced by diameter fluctuation during Czochralski silicon single crystal growth |
url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T03%3A22%3A53IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Anisotropic%20study%20of%20thermal%20stresses%20induced%20by%20diameter%20fluctuation%20during%20Czochralski%20silicon%20single%20crystal%20growth&rft.jtitle=Journal%20of%20crystal%20growth&rft.au=Asadi%20Noghabi,%20Omidreza&rft.date=2014-08-15&rft.volume=400&rft.spage=1&rft.epage=6&rft.pages=1-6&rft.issn=0022-0248&rft.eissn=1873-5002&rft.coden=JCRGAE&rft_id=info:doi/10.1016/j.jcrysgro.2014.04.027&rft_dat=%3Cproquest_cross%3E1567082805%3C/proquest_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c408t-2769daa7d99b4d8a36f9c56c02f47f89f6a64090b63ed78e5fc68415dcd0e1eb3%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=1567082805&rft_id=info:pmid/&rfr_iscdi=true |