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THERMAL STABILITY OF Cu-Al sub(2)O sub(3) AND CuCr MATERIALS
The aim of this work was the comparison of the thermal stability of dispersion strengthened (DS) Cu - 5 vol. % Al sub(2)O sub(3) system with the CuCr electrode material. The DS material is characterized by high hardness, high strength and excellent thermal stability of the structure due to the highl...
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Published in: | Powder Metallurgy Progress 2014-01, Vol.14 (2), p.108-112 |
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Main Authors: | , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Online Access: | Get full text |
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Summary: | The aim of this work was the comparison of the thermal stability of dispersion strengthened (DS) Cu - 5 vol. % Al sub(2)O sub(3) system with the CuCr electrode material. The DS material is characterized by high hardness, high strength and excellent thermal stability of the structure due to the highly stable gamma Al sub(2)O sub(3) dispersoid. The CuCr material has comparable hardness and strength, however the thermal stability is limited by the thermal stability of the precipitate. |
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ISSN: | 1335-8987 |