Thermal characterization of a bridge-link carbon nanotubes array used as a thermal adhesive

A dense and vertically aligned single-walled carbon nanotube (SWCNT) array was assembled between a chip and a substrate by a fluidic assembly method. The SWCNT bridged the interface as a thermal interface material (TIM). The minimum interfacial thermal resistance was measured close to 4.5mm2K/W by t...

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Bibliographic Details
Published in:International journal of adhesion and adhesives 2014-03, Vol.49, p.58-63
Main Authors: Rong, Hao, Lin, Wei-Qing, Zheng, Jin-Cheng, Lu, Miao
Format: Article
Language:English
Subjects:
Adhesion
Adhesives
Arrays
Carbon nanotube array
Chips
Shear strength
Single wall carbon nanotubes
Thermal adhesive
Thermal interface resistance
Thermal properties
Thermal resistance
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Summary:A dense and vertically aligned single-walled carbon nanotube (SWCNT) array was assembled between a chip and a substrate by a fluidic assembly method. The SWCNT bridged the interface as a thermal interface material (TIM). The minimum interfacial thermal resistance was measured close to 4.5mm2K/W by the laser flash method. This value was lower than that of commercial thermal grease. Filling up the remaining space of the SWCNT array with a highly penetrative glue (LOCTITE®4699™, Henkel Co. Korea) was found to produce a significant increase in shear strength from 450kPa to 3MPa, as well as an approximate 10% decrease in thermal diffusivity. The material's higher thermal performance is expected to allow a chip to make a good connection to a heat sink in microelectronics packaging, thus acting as a substitute for conventional thermal adhesives.
ISSN:0143-7496
1879-0127
DOI:10.1016/j.ijadhadh.2013.12.006