High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications

A new design of stripline transition structures and flip-chip interconnects for high-speed digital communication systems implemented in low-temperature cofired ceramic (LTCC) substrates is presented. Simplified fabrication, suitability for LTCC machining, suitability for integration with other compo...

Full description

Saved in:
Bibliographic Details
Published in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2015-03, Vol.5 (3), p.307-313
Main Authors: Decrossas, Emmanuel, Glover, Michael D., Porter, Kaoru, Cannon, Tom, Stegeman, Thomas, Allen-McCormack, Nicholas, Hamilton, Michael C., Mantooth, H. Alan
Format: Article
Language:English
Subjects:
Bit error rate
Ceramics
Communication systems
Connectors
Digital data
Fabrication
Frequency measurement
Full tape thickness feature
High speed
Interconnections
low-temperature cofired ceramic (LTCC) interconnect
multichip module (MCM)
Multichip modules
quasi-coaxial vertical transition
Signal integrity
Stripline
Striplines
system on package
Time-domain analysis
Transmission line measurements
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:A new design of stripline transition structures and flip-chip interconnects for high-speed digital communication systems implemented in low-temperature cofired ceramic (LTCC) substrates is presented. Simplified fabrication, suitability for LTCC machining, suitability for integration with other components, and connection to integrated stripline or microstrip interconnects for LTCC multichip modules and system on package make this approach well suited for miniaturized, advanced broadband, and highly integrated multichip ceramic modules. The transition provides excellent signal integrity at high-speed digital data rates up to 28 Gbits/s. Full-wave simulations and experimental results demonstrate a cost-effective solution for a wide frequency range from dc to 30 GHz and beyond. Signal integrity and high-speed digital data rate performances are verified through eye diagram and time-domain reflectometry and time-domain transmissometry measurements over a 10-cm long stripline.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2015.2394234