Effects of Silicon Nanoparticles on the Transient Liquid Phase Bonding of 304 Stainless Steel

Transient liquid phase （TLP） bonding of 304 stainless steel with nickel based filler metal, BNi-9, was performed to study the influence of silicon nanoparticles （NPs） on the mechanical and structural properties of the bonding area. It was found that silicon NPs act as a melting point depressant in t...

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Bibliographic Details
Published in:Journal of materials science & technology 2014-03, Vol.30 (3), p.259-262
Main Author: H.M. Hdz-Garcla A.I. Martinez R. Munoz-Arroyo J.L. Acevedo-Davilal E Garcia-Vdzquez F.A. Reyes- Valdes
Format: Article
Language:English
Subjects:
304不锈钢
Austenitic stainless steels
Bonding
Brazing
Dissolution
Materials science
Nanoparticles
Silicon
Stainless steel
Stainless steels
共晶结构
均匀分布
瞬间液相连接
硅纳米颗粒
结构特性
金属填料
镍基钎料
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Summary:Transient liquid phase （TLP） bonding of 304 stainless steel with nickel based filler metal, BNi-9, was performed to study the influence of silicon nanoparticles （NPs） on the mechanical and structural properties of the bonding area. It was found that silicon NPs act as a melting point depressant in the brazing process; the formation of silicon TLP induces the dissolution of elements of the metal filler and promotes a uniform distribution in the bonding area. Silicon NPs induce the development of smaller eutectic structures in the melting zone; it has been related to microhardness measurements, which are lower when the silicon NPs are used in the brazing process.
ISSN:1005-0302
1941-1162
DOI:10.1016/j.jmst.2013.11.006