Effects of Silicon Nanoparticles on the Transient Liquid Phase Bonding of 304 Stainless Steel

Transient liquid phase （TLP） bonding of 304 stainless steel with nickel based filler metal, BNi-9, was performed to study the influence of silicon nanoparticles （NPs） on the mechanical and structural properties of the bonding area. It was found that silicon NPs act as a melting point depressant in t...

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Published in:Journal of materials science & technology 2014-03, Vol.30 (3), p.259-262
Main Author: H.M. Hdz-Garcla A.I. Martinez R. Munoz-Arroyo J.L. Acevedo-Davilal E Garcia-Vdzquez F.A. Reyes- Valdes
Format: Article
Language:English
Subjects:
304不锈钢
Austenitic stainless steels
Bonding
Brazing
Dissolution
Materials science
Nanoparticles
Silicon
Stainless steel
Stainless steels
共晶结构
均匀分布
瞬间液相连接
硅纳米颗粒
结构特性
金属填料
镍基钎料
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description Transient liquid phase （TLP） bonding of 304 stainless steel with nickel based filler metal, BNi-9, was performed to study the influence of silicon nanoparticles （NPs） on the mechanical and structural properties of the bonding area. It was found that silicon NPs act as a melting point depressant in the brazing process; the formation of silicon TLP induces the dissolution of elements of the metal filler and promotes a uniform distribution in the bonding area. Silicon NPs induce the development of smaller eutectic structures in the melting zone; it has been related to microhardness measurements, which are lower when the silicon NPs are used in the brazing process.
doi_str_mv 10.1016/j.jmst.2013.11.006
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subjects 304不锈钢
Austenitic stainless steels
Bonding
Brazing
Dissolution
Materials science
Nanoparticles
Silicon
Stainless steel
Stainless steels
共晶结构
均匀分布
瞬间液相连接
硅纳米颗粒
结构特性
金属填料
镍基钎料
title Effects of Silicon Nanoparticles on the Transient Liquid Phase Bonding of 304 Stainless Steel
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