The Numerical Simulation for High Temperature Creep of the Porous Cu Alloy

• Published in: Key engineering materials 2013-09, Vol.573, p.105-112
• Main Authors: He, Jian Jun, Huang, Zi Han, He, Zhuo, Li, Wei, Ren, Yan Jie, Qiu, Wei, Chen, Jian Lin, Chen, Jian
• Format: Article
• Language: English
• Subjects: Compressing; COPPER ALLOYS (40 TO 99.3 CU); Copper base alloys; Creep (materials); CREEP PROPERTIES; Creep strength; ELEVATED TEMPERATURE; High temperature; MATHEMATICAL ANALYSIS; Mathematical models; Pore size; PORE SIZE AND SHAPE; Porosity
• ISSN: 1013-9826; 1662-9795; 1662-9795
• DOI: 10.4028/www.scientific.net/KEM.573.105

In this research, the compression deformation were investigated under different elevated temperatures and strain rates, in order to obtain the creep constitutive equation. The effects of aperture load and pore shape on the compression properties of porous Cu alloys were studied by simulating the creep compression deformation at elevated temperature in ANSYS software. Pore size, pore shape and load are the main factors on the high temperature compression creep properties in porous Cu alloys. Samples with larger pore size, higher load and temperature showed inferior compression creep resistance such as bigger creep deformation, faster creep rates, and more unstable creep deformation. Stress concentrations generating around the edge in the wall of the pore were observed. Otherwise, the shape of pore has a severe influence on the structure properties of the material, i.e. every increase of pore edge corresponds to a decrease of stability in structure.