An all-solid-state, WDM silicon photonic digital link for chip-to-chip communications

We describe a multiwavelength hybrid-integrated solid-state link on a 3 µm silicon-on-insulator (SOI) nanophotonic platform. The link spans three chips and employs germanium-silicon electroabsorption waveguide modulators, silicon transport waveguides, echelle gratings for multiplexing and demultiple...

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Bibliographic Details
Published in:Optics express 2015-05, Vol.23 (10), p.12808-12822
Main Authors: Thacker, Hiren D, Zheng, Xuezhe, Lexau, Jon, Shafiiha, Roshanak, Shubin, Ivan, Lin, Shiyun, Djordjevic, Stevan, Amberg, Philip, Chang, Eric, Liu, Frankie, Simons, John, Lee, Jin-Hyoung, Abed, Arin, Liang, Hong, Luo, Ying, Yao, Jin, Feng, Dazeng, Asghari, Mehdi, Ho, Ron, Raj, Kannan, Cunningham, John E, Krishnamoorthy, Ashok V
Format: Article
Language:English
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Summary:We describe a multiwavelength hybrid-integrated solid-state link on a 3 µm silicon-on-insulator (SOI) nanophotonic platform. The link spans three chips and employs germanium-silicon electroabsorption waveguide modulators, silicon transport waveguides, echelle gratings for multiplexing and demultiplexing, and pure germanium waveguide photo-detectors. The 8λ WDM Tx and Rx components are interconnected via a routing "bridge" chip using edge-coupled optical proximity communication. The packaged, retimed digital WDM link is demonstrated at 10 Gb/s and 10(-12) BER, with three wavelength channels consuming an on-chip power below 1.5 pJ/bit, excluding the external laser power.
ISSN:1094-4087
1094-4087
DOI:10.1364/oe.23.012808