Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads

•Sn3.5Ag0.5Cu–nano-Al2O3 composite solder BGA joints was investigated.•Both scallop- and prism- modes were observed after reflowing.•Al2O3 suppressed Cu6Sn5 growth, significantly improving the shear strength. A Sn3.5Ag0.5Cu (SAC)–XAl2O3 nano-composite solder was prepared by adding 100nm Al2O3 to SAC...

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Bibliographic Details
Published in:Materials in engineering 2013-09, Vol.50, p.774-781
Main Authors: Tsao, L.C., Wu, R.W., Cheng, Te-Hsien, Fan, Kuo-Huan, Chen, R.S.
Format: Article
Language:English
Subjects:
A. Non-ferros metals and alloys
Arrays
D. Brazing and soldering
F. Microstructure
Mechanical properties
Microstructure
Nanocomposites
Nanomaterials
Nanostructure
Solders
Tin
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Summary:•Sn3.5Ag0.5Cu–nano-Al2O3 composite solder BGA joints was investigated.•Both scallop- and prism- modes were observed after reflowing.•Al2O3 suppressed Cu6Sn5 growth, significantly improving the shear strength. A Sn3.5Ag0.5Cu (SAC)–XAl2O3 nano-composite solder was prepared by adding 100nm Al2O3 to SAC (wt.%) solder. The interfacial microstructures and mechanical properties of SAC–XAl2O3 nano-composite solder balls on immersion Sn surface finished BGA joints after multiple reflows was investigated. As a whole, adding Al2O3 nanoparticles to SAC solders significantly changed in the interfacial microstructure, and both scallop-type and prism-type modes were observed in the plain SAC solder and SAC–XAl2O3 nano-composite solder after reflowing, respectively. The nanoparticles suppressed the growth of the Cu6Sn5 layer, significantly improving the shear strength. The fracture surfaces of the plain SAC solder showed a semi-brittle fracture mode, but those of the SAC–XAl2O3 nano-composite solder exhibited typical ductile failures.
ISSN:0261-3069
DOI:10.1016/j.matdes.2013.03.045