Loading…

Particle-free gold metal–organic decomposition ink for inkjet printing of gold structures

The application of liquid [AuO2CCH2(OCH2CH2)2OCH3(nBu3P)] (1) as a metal–organic decomposition ink containing 34.2wt.% of gold is reported. Chemical and physical properties of 1 are discussed. The ink formulated of 20wt.% of 1 in toluene (gold concentration 6.9wt.%) exhibits rheological properties w...

Full description

Saved in:
Bibliographic Details
Published in:Thin solid films 2013-03, Vol.531, p.147-151
Main Authors: Schoner, Claudia, Tuchscherer, André, Blaudeck, Thomas, Jahn, Stephan F., Baumann, Reinhard R., Lang, Heinrich
Format: Article
Language:English
Subjects:
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The application of liquid [AuO2CCH2(OCH2CH2)2OCH3(nBu3P)] (1) as a metal–organic decomposition ink containing 34.2wt.% of gold is reported. Chemical and physical properties of 1 are discussed. The ink formulated of 20wt.% of 1 in toluene (gold concentration 6.9wt.%) exhibits rheological properties well-suited for piezo inkjet printing. Conversion into electrically conductive gold was accomplished by thermal treatment optimized to provide best possible conductivity, contour accuracy, and layer homogeneity. The thermal decomposition of 1 was studied by thermogravimetry–mass spectrometry coupling experiments. It was found that at first decarboxylation takes place forming [AuCH2(OCH2CH2)2OCH3(PnBu3)], further heating cleaves the AuP bond and releases PnBu3. This resulting compound decomposes via AuC, CC and CO bond cleavage processes giving gold and appropriate organics (CxHyOz (x≥3)). The printed features exhibit conductivities of up to 1.9×107S·m−1 on glass which corresponds to 43% of bulk gold conductivity. ► Particle-free, metal–organic gold ink suitable for inkjet-printing ► Experiments are based on liquid gold(I) precursor [Au(O2CCH2(OCH2CH2)2OCH3)(nBu3P)]. ► Study of decomposition mechanism ► Study of sintering profile and conductivity
ISSN:0040-6090
1879-2731
DOI:10.1016/j.tsf.2013.01.027