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Small-Area, Resistive Volatile Organic Compound (VOC) Sensors Using Metal–Polymer Hybrid Film Based on Oxidative Chemical Vapor Deposition (oCVD)
We report a novel room temperature methanol sensor comprised of gold nanoparticles covalently attached to the surface of conducting copolymer films. The copolymer films are synthesized by oxidative chemical vapor deposition (oCVD), allowing substrate-independent deposition, good polymer conductivity...
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Published in: | ACS applied materials & interfaces 2015-08, Vol.7 (30), p.16213-16222 |
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Main Authors: | , , , , , , , , |
Format: | Article |
Language: | English |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | We report a novel room temperature methanol sensor comprised of gold nanoparticles covalently attached to the surface of conducting copolymer films. The copolymer films are synthesized by oxidative chemical vapor deposition (oCVD), allowing substrate-independent deposition, good polymer conductivity and stability. Two different oCVD copolymers are examined: poly(3,4-ethylenedioxythiophene-co-thiophene-3-aceticacid)[poly(EDOT-co-TAA)] and poly(3,4-ehylenedioxythiophene-co-thiophene-3-ethanol)[poly(EDOT-co-3-TE)]. Covalent attachment of gold nanoparticles to the functional groups of the oCVD films results in a hybrid system with efficient sensing response to methanol. The response of the poly(EDOT-co-TAA)/Au devices is found to be superior to that of the other copolymer, confirming the importance of the linker molecules (4-aminothiophenol) in the sensing behavior. Selectivity of the sensor to methanol over n-pentane, acetone, and toluene is demonstrated. Direct fabrication on a printed circuit board (PCB) is achieved, resulting in an improved electrical contact of the organic resistor to the metal circuitry and thus enhanced sensing properties. The simplicity and low fabrication cost of the resistive element, mild working temperature, together with its compatibility with PCB substrates pave the way for its straightforward integration into electronic devices, such as wireless sensor networks. |
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ISSN: | 1944-8244 1944-8252 |
DOI: | 10.1021/acsami.5b05392 |