In situ TEM/SEM electronic/mechanical characterization of nano material with MEMS chip

• Published in: Journal of semiconductors 2014-08, Vol.35 (8), p.1-9
• Main Author: 王跃林 李铁 张啸 曾鸿江 金钦华
• Format: Article
• Language: English
• Subjects: Chips; Devices; Electronics; Microelectromechanical systems; Nanostructure; Scanning electron microscopy; SEM; Semiconductors; TEM; Transmission electron microscopy; 原位观察; 微机电系统; 机械性能; 电子特性; 纳米材料; 透射电子显微镜
• ISSN: 1674-4926
• DOI: 10.1088/1674-4926/35/8/081001

Our investigation of in situ observations on electronic and mechanical properties of nano materials using a scanning electron microscope （SEM） and a transmission electron microscope （TEM） with the help of tradi- tional micro-electro-mechanical system （MEMS） technology has been reviewed. Thanks to the stability, continuity and controllability of the loading force from the electrostatic actuator and the sensitivity of the sensor beam, a MEMS tensile testing chip for accurate tensile testing in the nano scale is obtained. Based on the MEMS chips, the scale effect of Young＇s modulus in silicon has been studied and confirmed directly in a tensile experiment using a transmission electron microscope. Employing the nanomanipulation technology and FIB technology, Cu and SiC nanowires have been integrated into the tensile testing device and their mechanical, electronic properties under different stress have been achieved, simultaneously. All these will aid in better understanding the nano effects and contribute to the designation and application in nano devices.