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Light output enhancement of GaN-based light-emitting diodes by maskless surface roughening
[Display omitted] •Surface morphologies were roughened without the use of masks.•Surface morphologies were optimized by varying Cl2 concentration.•Surface morphologies were optimized by adjusting RF bias power.•Light output of surface-roughened LEDs was enhanced by 43.2%. In the present paper, the s...
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Published in: | Microelectronic engineering 2015-05, Vol.139, p.39-42 |
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container_end_page | 42 |
container_issue | |
container_start_page | 39 |
container_title | Microelectronic engineering |
container_volume | 139 |
creator | Yang, Yibin Ren, Yuan Chen, Yangxiang Liu, Minggang Chen, Weijie Han, Xiaobiao Lin, Xiuqi Liao, Qiang Zang, Wenjie Luo, Hui Lin, Jiali Wu, Zhisheng Liu, Yang Zhang, Baijun |
description | [Display omitted]
•Surface morphologies were roughened without the use of masks.•Surface morphologies were optimized by varying Cl2 concentration.•Surface morphologies were optimized by adjusting RF bias power.•Light output of surface-roughened LEDs was enhanced by 43.2%.
In the present paper, the surface of GaN-based light-emitting diodes (LEDs) was roughened by inductively coupled plasma reactive ion etching (ICP-RIE) system. Without the utilization of etching mask, the roughened surface morphologies were optimized by varying Cl2 concentration in Cl2/BCl3/N2 mixing gas and adjusting RF bias power parameters of the ICP system. There was no obvious degradation of electrical properties of surface-roughened LEDs after the ICP dry etching process. Furthermore, the light output power of surface-roughened LEDs was enhanced by 43.2%, compared with conventional LEDs. |
doi_str_mv | 10.1016/j.mee.2015.04.088 |
format | article |
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•Surface morphologies were roughened without the use of masks.•Surface morphologies were optimized by varying Cl2 concentration.•Surface morphologies were optimized by adjusting RF bias power.•Light output of surface-roughened LEDs was enhanced by 43.2%.
In the present paper, the surface of GaN-based light-emitting diodes (LEDs) was roughened by inductively coupled plasma reactive ion etching (ICP-RIE) system. Without the utilization of etching mask, the roughened surface morphologies were optimized by varying Cl2 concentration in Cl2/BCl3/N2 mixing gas and adjusting RF bias power parameters of the ICP system. There was no obvious degradation of electrical properties of surface-roughened LEDs after the ICP dry etching process. Furthermore, the light output power of surface-roughened LEDs was enhanced by 43.2%, compared with conventional LEDs.</description><identifier>ISSN: 0167-9317</identifier><identifier>EISSN: 1873-5568</identifier><identifier>DOI: 10.1016/j.mee.2015.04.088</identifier><language>eng</language><publisher>Elsevier B.V</publisher><subject>Drying ; Electric power generation ; Electrical properties ; Etching ; ICP dry etching ; Inductively coupled plasma ; Light-emitting diodes ; Maskless surface roughening ; Reactive ion etching ; Roughening</subject><ispartof>Microelectronic engineering, 2015-05, Vol.139, p.39-42</ispartof><rights>2015 Elsevier B.V.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c330t-44b073c13ae72bfdfd8d00d7bfbbe6d323ea6a05120e32b9b74c01427ac953d83</citedby><cites>FETCH-LOGICAL-c330t-44b073c13ae72bfdfd8d00d7bfbbe6d323ea6a05120e32b9b74c01427ac953d83</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids></links><search><creatorcontrib>Yang, Yibin</creatorcontrib><creatorcontrib>Ren, Yuan</creatorcontrib><creatorcontrib>Chen, Yangxiang</creatorcontrib><creatorcontrib>Liu, Minggang</creatorcontrib><creatorcontrib>Chen, Weijie</creatorcontrib><creatorcontrib>Han, Xiaobiao</creatorcontrib><creatorcontrib>Lin, Xiuqi</creatorcontrib><creatorcontrib>Liao, Qiang</creatorcontrib><creatorcontrib>Zang, Wenjie</creatorcontrib><creatorcontrib>Luo, Hui</creatorcontrib><creatorcontrib>Lin, Jiali</creatorcontrib><creatorcontrib>Wu, Zhisheng</creatorcontrib><creatorcontrib>Liu, Yang</creatorcontrib><creatorcontrib>Zhang, Baijun</creatorcontrib><title>Light output enhancement of GaN-based light-emitting diodes by maskless surface roughening</title><title>Microelectronic engineering</title><description>[Display omitted]
•Surface morphologies were roughened without the use of masks.•Surface morphologies were optimized by varying Cl2 concentration.•Surface morphologies were optimized by adjusting RF bias power.•Light output of surface-roughened LEDs was enhanced by 43.2%.
In the present paper, the surface of GaN-based light-emitting diodes (LEDs) was roughened by inductively coupled plasma reactive ion etching (ICP-RIE) system. Without the utilization of etching mask, the roughened surface morphologies were optimized by varying Cl2 concentration in Cl2/BCl3/N2 mixing gas and adjusting RF bias power parameters of the ICP system. There was no obvious degradation of electrical properties of surface-roughened LEDs after the ICP dry etching process. Furthermore, the light output power of surface-roughened LEDs was enhanced by 43.2%, compared with conventional LEDs.</description><subject>Drying</subject><subject>Electric power generation</subject><subject>Electrical properties</subject><subject>Etching</subject><subject>ICP dry etching</subject><subject>Inductively coupled plasma</subject><subject>Light-emitting diodes</subject><subject>Maskless surface roughening</subject><subject>Reactive ion etching</subject><subject>Roughening</subject><issn>0167-9317</issn><issn>1873-5568</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2015</creationdate><recordtype>article</recordtype><recordid>eNp9kD1PwzAQhi0EEqXwA9g8siSc4yROxYQQFKQKFlhYLH9cWpd8FNtB6r_HVZmZTu_peU-6h5BrBjkDVt9u8x4xL4BVOZQ5NM0JmbFG8Kyq6uaUzBIjsgVn4pxchLCFlEtoZuRz5dabSMcp7qZIcdiowWCPQ1q1dKleM60CWtodqAx7F6Mb1tS60WKgek97Fb46DIGGybfKIPXjtN7gkKhLctaqLuDV35yTj6fH94fnbPW2fHm4X2WGc4hZWWoQ3DCuUBS6ta1tLIAVutUaa8sLjqpWULECkBd6oUVpgJWFUGZRcdvwObk53t358XvCEGXvgsGuUwOOU5BMVLxKkopFQtkRNX4MwWMrd971yu8lA3nwKLcyeZQHjxJKmTymzt2xg-mHH4deBuMwWbLOo4nSju6f9i_lgnxF</recordid><startdate>20150501</startdate><enddate>20150501</enddate><creator>Yang, Yibin</creator><creator>Ren, Yuan</creator><creator>Chen, Yangxiang</creator><creator>Liu, Minggang</creator><creator>Chen, Weijie</creator><creator>Han, Xiaobiao</creator><creator>Lin, Xiuqi</creator><creator>Liao, Qiang</creator><creator>Zang, Wenjie</creator><creator>Luo, Hui</creator><creator>Lin, Jiali</creator><creator>Wu, Zhisheng</creator><creator>Liu, Yang</creator><creator>Zhang, Baijun</creator><general>Elsevier B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7QQ</scope><scope>7SP</scope><scope>7SR</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20150501</creationdate><title>Light output enhancement of GaN-based light-emitting diodes by maskless surface roughening</title><author>Yang, Yibin ; Ren, Yuan ; Chen, Yangxiang ; Liu, Minggang ; Chen, Weijie ; Han, Xiaobiao ; Lin, Xiuqi ; Liao, Qiang ; Zang, Wenjie ; Luo, Hui ; Lin, Jiali ; Wu, Zhisheng ; Liu, Yang ; Zhang, Baijun</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c330t-44b073c13ae72bfdfd8d00d7bfbbe6d323ea6a05120e32b9b74c01427ac953d83</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2015</creationdate><topic>Drying</topic><topic>Electric power generation</topic><topic>Electrical properties</topic><topic>Etching</topic><topic>ICP dry etching</topic><topic>Inductively coupled plasma</topic><topic>Light-emitting diodes</topic><topic>Maskless surface roughening</topic><topic>Reactive ion etching</topic><topic>Roughening</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Yang, Yibin</creatorcontrib><creatorcontrib>Ren, Yuan</creatorcontrib><creatorcontrib>Chen, Yangxiang</creatorcontrib><creatorcontrib>Liu, Minggang</creatorcontrib><creatorcontrib>Chen, Weijie</creatorcontrib><creatorcontrib>Han, Xiaobiao</creatorcontrib><creatorcontrib>Lin, Xiuqi</creatorcontrib><creatorcontrib>Liao, Qiang</creatorcontrib><creatorcontrib>Zang, Wenjie</creatorcontrib><creatorcontrib>Luo, Hui</creatorcontrib><creatorcontrib>Lin, Jiali</creatorcontrib><creatorcontrib>Wu, Zhisheng</creatorcontrib><creatorcontrib>Liu, Yang</creatorcontrib><creatorcontrib>Zhang, Baijun</creatorcontrib><collection>CrossRef</collection><collection>Ceramic Abstracts</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Microelectronic engineering</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Yang, Yibin</au><au>Ren, Yuan</au><au>Chen, Yangxiang</au><au>Liu, Minggang</au><au>Chen, Weijie</au><au>Han, Xiaobiao</au><au>Lin, Xiuqi</au><au>Liao, Qiang</au><au>Zang, Wenjie</au><au>Luo, Hui</au><au>Lin, Jiali</au><au>Wu, Zhisheng</au><au>Liu, Yang</au><au>Zhang, Baijun</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Light output enhancement of GaN-based light-emitting diodes by maskless surface roughening</atitle><jtitle>Microelectronic engineering</jtitle><date>2015-05-01</date><risdate>2015</risdate><volume>139</volume><spage>39</spage><epage>42</epage><pages>39-42</pages><issn>0167-9317</issn><eissn>1873-5568</eissn><abstract>[Display omitted]
•Surface morphologies were roughened without the use of masks.•Surface morphologies were optimized by varying Cl2 concentration.•Surface morphologies were optimized by adjusting RF bias power.•Light output of surface-roughened LEDs was enhanced by 43.2%.
In the present paper, the surface of GaN-based light-emitting diodes (LEDs) was roughened by inductively coupled plasma reactive ion etching (ICP-RIE) system. Without the utilization of etching mask, the roughened surface morphologies were optimized by varying Cl2 concentration in Cl2/BCl3/N2 mixing gas and adjusting RF bias power parameters of the ICP system. There was no obvious degradation of electrical properties of surface-roughened LEDs after the ICP dry etching process. Furthermore, the light output power of surface-roughened LEDs was enhanced by 43.2%, compared with conventional LEDs.</abstract><pub>Elsevier B.V</pub><doi>10.1016/j.mee.2015.04.088</doi><tpages>4</tpages></addata></record> |
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subjects | Drying Electric power generation Electrical properties Etching ICP dry etching Inductively coupled plasma Light-emitting diodes Maskless surface roughening Reactive ion etching Roughening |
title | Light output enhancement of GaN-based light-emitting diodes by maskless surface roughening |
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