Vertical assembly of carbon nanotubes for via interconnects

The via interconnects are key components in ultra-large scale integrated circuits （ULSI）. This paper deals with a new method to create single-walled carbon nanotubes （SWNTs） via interconnects using alternating dielectrophoresis （DEP）. Carbon nanotubes are vertically assembled in the microscale via-h...

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Bibliographic Details
Published in:Chinese physics B 2012-08, Vol.21 (8), p.6-13
Main Author: 魏芹芹 魏子钧 任黎明 赵华波 叶天扬 施祖进 傅云义 张兴 黄如
Format: Article
Language:English
Subjects:
Assembly
Carbon nanotubes
Contact resistance
Dielectrophoresis
Electrodes
Integrated circuits
Interconnections
Single wall carbon nanotubes
SWNTs
Ultra Large Scale Integration
互连
单壁碳纳米管
垂直
总装
组成部分
组装技术
超大规模集成电路
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Summary:The via interconnects are key components in ultra-large scale integrated circuits （ULSI）. This paper deals with a new method to create single-walled carbon nanotubes （SWNTs） via interconnects using alternating dielectrophoresis （DEP）. Carbon nanotubes are vertically assembled in the microscale via-holes successfully at room temperature under ambient condition. The electrical evaluation of the SWNT vias reveals that our DEP assembly technique is highly reliable and the success rate of assembly can be as high as 90%. We also propose and test possible approaches to reducing the contact resistance between CNT vias and metal electrodes.
ISSN:1674-1056
2058-3834
1741-4199
DOI:10.1088/1674-1056/21/8/088103