An Investigation of Factors Affecting and Optimizing Material Removal Rate in Computer Controlled Ultra-Precision Polishing

There are numerous parameters and steps involved in a computer controlled ultra-precision polishing process (CCUP). The success of CCUP relies heavily on the understanding and optimization of material removal when new materials and new surfaces are polished. It is crucial to optimize the polishing p...

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Bibliographic Details
Published in:Key engineering materials 2014-08, Vol.625, p.446-452
Main Authors: Zeng, Sheng Yue, Cheung, Chi Fai, Ho, Lai Ting, Blunt, Liam
Format: Article
Language:English
Subjects:
Alloys
Implants
Optimization
Orthopedics
Polished
Polishing
Process parameters
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Summary:There are numerous parameters and steps involved in a computer controlled ultra-precision polishing process (CCUP). The success of CCUP relies heavily on the understanding and optimization of material removal when new materials and new surfaces are polished. It is crucial to optimize the polishing parameters to enhance the effectiveness of the polishing process and to assess the impact of different process parameters on the material removal rate of particular difficult-to-machine materials such as CoCr alloys, which is commonly used in orthopedic implants. This paper aims at studying the process parameters and optimization of the parameter to enhance the material removal rate and quantify the contribution of process parameters.
ISSN:1013-9826
1662-9795
1662-9795
DOI:10.4028/www.scientific.net/KEM.625.446