Efficient Transfer of Large-Area Graphene Films onto Rigid Substrates by Hot Pressing

Graphene films grown on metal substrates by chemical vapor deposition (CVD) method have to be safely transferred onto desired substrates for further applications. Recently, a roll-to-roll (R2R) method has been developed for large-area transfer, which is particularly efficient for flexible target sub...

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Bibliographic Details
Published in:ACS nano 2012-06, Vol.6 (6), p.5360-5365
Main Authors: Kang, Junmo, Hwang, Soonhwi, Kim, Jae Hwan, Kim, Min Hyeok, Ryu, Jaechul, Seo, Sang Jae, Hong, Byung Hee, Kim, Moon Ki, Choi, Jae-Boong
Format: Article
Language:English
Subjects:
Chemical vapor deposition
Continuums
Damage
Electric Conductivity
Electrical properties
Glass
Graphene
Graphite - chemistry
Hot Temperature
Macromolecular Substances - chemistry
Materials Testing
Membranes, Artificial
Molecular Conformation
Molecular Imprinting - methods
Nanoparticles - chemistry
Nanoparticles - ultrastructure
Nanostructure
Particle Size
Pressure
Scanning electron microscopy
Stresses
Surface Properties
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Summary:Graphene films grown on metal substrates by chemical vapor deposition (CVD) method have to be safely transferred onto desired substrates for further applications. Recently, a roll-to-roll (R2R) method has been developed for large-area transfer, which is particularly efficient for flexible target substrates. However, in the case of rigid substrates such as glass or wafers, the roll-based method is found to induce considerable mechanical damages on graphene films during the transfer process, resulting in the degradation of electrical property. Here we introduce an improved dry transfer technique based on a hot-pressing method that can minimize damage on graphene by neutralizing mechanical stress. Thus, we enhanced the transfer efficiency of the large-area graphene films on a substrate with arbitrary thickness and rigidity, evidenced by scanning electron microscope (SEM) and atomic force microscope (AFM) images, Raman spectra, and various electrical characterizations. We also performed a theoretical multiscale simulation from continuum to atomic level to compare the mechanical stresses caused by the R2R and the hot-pressing methods, which also supports our conclusion. Consequently, we believe that the proposed hot-pressing method will be immediately useful for display and solar cell applications that currently require rigid and large substrates.
ISSN:1936-0851
1936-086X
DOI:10.1021/nn301207d