Flip chip assembly of thinned chips for hybrid pixel detector applications

A new technology using glass carrier wafer will be described in detail. The main advantage of this technology is the combination of a carrier support during wafer processing and the chip support during flip chip assembly. For that a glass wafer is glue-bonded onto the backside of the thinned readout...

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Bibliographic Details
Published in:Journal of instrumentation 2014-05, Vol.9 (5), p.C05039-C05039
Main Authors: Fritzsch, T, Zoschke, K, Woehrmann, M, Rothermund, M, Huegging, F, Ehrmann, O, Oppermann, H, Lang, K D
Format: Article
Language:English
Subjects:
Assembly
Carriers
Chips
Deposition
Detectors
Glass
Instrumentation
Wafers
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Summary:A new technology using glass carrier wafer will be described in detail. The main advantage of this technology is the combination of a carrier support during wafer processing and the chip support during flip chip assembly. For that a glass wafer is glue-bonded onto the backside of the thinned readout chip wafer. After the bump deposition process the glass-readout chip stack is diced in one step. Finally the glass carrier chip is released by laser illumination after flip chip assembly of the readout chip onto sensor tile. The results of the flip chip assembly process development for the ATFAS IBF upgrade are described more in detail.
ISSN:1748-0221
1748-0221
DOI:10.1088/1748-0221/9/05/C05039